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Keywords: nanoindentation
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 26–28, 2021
Paper No: IPACK2021-73197
... Fatigue of SAC105 Solder Material after Extended Room Temperature Aging , Master of Science Thesis, 2017 V001T07A008-7 Copyright © 2021 by ASME and The United States Government silver nano-particle inks aerosol-jet printing (AJP) thermal cycling finite-element modeling (FEM) nanoindentation...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021
Paper No: IPACK2021-73348
... and the hardness is considered as one of the ideal substitutes of Sn-Pb solder due of the IMC layers were evaluated using a nanoindenter. The to its good solderability and creep resistance [2]. The main IMC layer thickness and the chemical composition of the IMC limitation of this kind of solder...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 27–29, 2020
Paper No: IPACK2020-2655
... thermal cycles was evaluated using the nanoindentation technique. In this work, nanoindentation technique was utilized to understand the evolution of creep behavior of the SAC305 solder joint, die attachment adhesive, silicon die, and solder mask material for various durations of thermal cycling. Test...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 7–9, 2019
Paper No: IPACK2019-6471
...NANOINDENTATION TESTING OF SAC305 SOLDER JOINTS SUBJECTED TO THERMAL CYCLING LOADING Abdullah Fahim, S M Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn University Auburn, AL 36849 Phone: +1-334-844-3332 FAX: +1-334-844...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 7–9, 2019
Paper No: IPACK2019-6567
... were gripped and then subjected to mechanical cycling in the shear using an Instron Micromechanical tester. Testing was performed on both SAC305 and SACX (SAC+Bi) solder joints. The joints were cycled for certain durations, and a nanoindentation system was used to measure the evolution...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A015, July 16–18, 2013
Paper No: IPACK2013-73234
... nanoindentation techniques, the stress-strain and creep behavior of the SAC solder materials have been explored at the joint scale for various aging conditions. Mechanical properties characterized as a function of aging include the elastic modulus, hardness, and yield stress. Using a constant force at max...