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Keywords: lead free solder
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Paper No: IPACK2021-74044
... of normalized properties of SAC305 lead-free solder material under different properties with respect to elapsed time under different thermal thermal cycling exposures have been reported for up to 5 days cycling exposures. Finally, the microstructural evolution of of thermal cycling. It was found that thermal...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 27–29, 2020
Paper No: IPACK2020-2655
.... KEYWORDS Lead Free Solder, Solder Mask, Die Attach, Die, Thermal Cycling, Nanoindentation, Creep. INTRODUCTION The reliability of an electronic package is a key factor to the packaging industry which is primarily determined by the environmental and operating conditions in which it is used. One...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Paper No: IPACK2020-2695
... reductions in the board level reliability of lead-free electronic assemblies subjected to aging. In our recent research, Scanning Electron Microscopy (SEM) has been used to: (1) monitor aging induced microstructural changes occurring within fixed regions in selected lead-free solder joints, (2) create time...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 7–9, 2019
Paper No: IPACK2019-6471
... to thermal cycling up to 250 cycles. KEYWORDS Lead Free Solder, Thermal Cycling, Nanoindentation, Hardness, Elastic Modulus, Creep, Strain Rate INTRODUCTION The reliability of an electronic package is determined by the environment and operating conditions in which it is used. Solder interconnections still...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 7–9, 2019
Paper No: IPACK2019-6560
...EVOLUTION OF THE MICROSTRUCTURE OF LEAD FREE SOLDERS SUBJECTED TO BOTH AGING AND CYCLIC LOADING Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Jeffrey C. Suhling, Sa d Hamasha, Pradeep Lall Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn University Auburn, AL 36849...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 7–9, 2019
Paper No: IPACK2019-6571
...Abstract Abstract Aging effects are common in lead free solder joints within electronic assemblies that are exposed to isothermal environments for extended periods. Such exposures lead to evolution of the solder microstructure, which results in changes in the mechanical properties and creep...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A008, July 16–18, 2013
Paper No: IPACK2013-73230
... The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. Traditional finite element based predictions for solder joint reliability during thermal...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A009, July 16–18, 2013
Paper No: IPACK2013-73232
... constitutive equations for solder with aging effects have also been incorporated into commercial finite element codes (ANSYS and ABAQUS). Lead Free Solder Aging Evolution Anand Model Constitutive Relations A REVISED ANAND CONSTITUTIVE MODEL FOR LEAD FREE SOLDER THAT INCLUDES AGING EFFECTS...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A011, July 16–18, 2013
Paper No: IPACK2013-73240
... (positive and negative) mechanical strains and stresses. This cyclic loading leads to thermomechanical fatigue damage that involves damage accumulation, crack initiation, crack propagation, and failure. In addition, the microstructure, mechanical response, and failure behavior of lead free solder joints...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A016, July 16–18, 2013
Paper No: IPACK2013-73241
... The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that large degradations occur...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 733-748, July 6–8, 2011
Paper No: IPACK2011-52184
... SOLDERS Zijie Cai, Jeffrey C. Suhling, Pradeep Lall, Michael J. Bozack Center for Advanced Vehicle Electronics Auburn University Auburn, AL 36849 Phone: +1-334-844-3332 FAX: +1-334-844-3307 E-Mail: jsuhling@eng.auburn.edu ABSTRACT The microstructure, mechanical response, and failure behavior of lead free...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 507-518, July 6–8, 2011
Paper No: IPACK2011-52186
... studies on the effects of aging on solder failure and fatigue behavior. In this investigation, we have examined the effects of aging on the cyclic stress-strain behavior of lead free solders. Uniaxial SAC lead free solder specimens were subjected to cyclic (tension/compression) mechanical loading. Samples...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1109-1113, July 17–22, 2005
Paper No: IPACK2005-73063
... determine the solder joint reliability. Board level drop test reliability of two solder compositions (SnPb and lead free SnAgCu) and surface finishes (Ni/Au and OSP) were examined in this study. The result indicated SnAgCu lead free solder showed poorer reliability life than Sn-Pb solder during drop impact...