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Keywords: die attach qualification
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Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1575-1581, July 17–22, 2005
Paper No: IPACK2005-73437
... characterization of the different die attach layers, as a major indicator of the reliability of the package. Stacked dies packages steady state and dynamic compact modeling thermal transient measurements die attach qualification Proceedings of IPACK2005 ASME InterPACK '05 cel pac Sta acc pac is tec...