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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 27–29, 2020
Paper No: IPACK2020-2655
.... solder joint, silicon die, die attachment adhesive, mold compound, solder mask, etc. All of these materials play a significant role on the reliability of the overall package. Failure under creep deformation is one of the significant failure mode for electronic packages. Hence, it is important to study...