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Keywords: datacenter
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Paper No: IPACK2022-97587
... are generated by iterating the fan speed and inlet temperature of air and comparing them with the baseline design of the server. Conclusions are made on the reduction in fan power due to the improved chassis design and any reduction in temperatures of air-cooled components. Keywords: Datacenter, Air-cooling...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 26–28, 2021
Paper No: IPACK2021-72620
...Abstract Abstract Passive, gravity-driven thermosyphons represent a step-change in technology towards the goal of greatly reducing PUE (Power Usage Effectiveness) of datacenters by replacing energy hungry fans of air-cooling approach with a highly-reliable solution able to dissipate the rising...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 7–9, 2019
Paper No: IPACK2019-6522
... savings and reliability. The results are presented for general guidance for flexible and quick installation and safe operation of in-row coolers to improve thermal efficiency. datacenter hot spot rack containment in-row coolers OPTIMAL DESIGN AND MODELING OF SERVER CABINETS WITH IN-ROW COOLERS...