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Keywords: SAC105
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97452
... modeling and reliability prediction are required for risk minimization with the use of new alloy formulations in high-reliability applications. The current work fills this state-of-the-art gap by measuring the mechanical characteristics of undoped SAC105 and doped SAC-Q solder alloys at low operation...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74068
... high strain rate doped solders SAC105 SAC-Q thermal aging Anand viscoplastic model Abstract During operations, handling, and storage in extreme environmental applications including aerospace, defense and automotive, the electronics may be exposed to high and low operating...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2658
... rates (10-75 per sec) for aged SAC (SAC105 and SAC-Q) solder alloys has been studied. Stress-Strain curves have been obtained at low operating temperatures using tensile tests. The SAC leadfree solder samples were subjected to isothermal-aged up to 4-months at 50°C before testing. Anand Viscoplastic...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6577
... high strain rate SAC105 SAC-Q thermal aging Anand Viscoplastic model Abstract Electronic components in downhole oil drilling and gas industry applications, automotive and avionics may exposed to high temperatures (> 150°C) and high strain rates (1–100 per sec) during storage...