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Keywords: SAC-Q
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Paper No: IPACK2022-97452
... characteristics of undoped SAC105 and doped SAC-Q solder alloys at low operation temperatures (−65°C to 0°C) at high strain rate after varied thermal aging periods up to one year. In addition, the evolution of Anand parameters for SAC solder alloys after prolonged thermal aging has been studied. The Anand model’s...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Paper No: IPACK2022-97438
... SAC-Q FOR ISOTHERMAL AGING UP TO 240-DAYS AT 100oC Pradeep Lall1 Auburn University, NSF- CAVE3 Electronics Research Center, Department of Mechanical Engineering, Auburn, AL 36849 +1(334)844-3424 lall@auburn.edu Vishal Mehta Auburn University, NSF- CAVE3 Electronics Research Center, Department...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021
Paper No: IPACK2021-74068
.... In this paper, materials characterization of h0 Hardening or softening constant SAC (SAC105 and SAC-Q) solder after prolonged storage at low a Strain rate sensitivity of hardening or softening operating temperatures (-65°C-0 °C) and at high strain rates s internal variable (10-75 per sec) has been studied...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A020, October 26–28, 2021
Paper No: IPACK2021-74067
...Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online IPACK2021-74067 MECHANICAL PROPERTIES OF DOPED SOLDER SAC-Q FOR HIGH STRAIN RATE TESTING AT EXTREME...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Paper No: IPACK2020-2658
... rates (10-75 per sec) for aged SAC (SAC105 and SAC-Q) solder alloys has been studied. Stress-Strain curves have been obtained at low operating temperatures using tensile tests. The SAC leadfree solder samples were subjected to isothermal-aged up to 4-months at 50°C before testing. Anand Viscoplastic...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 27–29, 2020
Paper No: IPACK2020-2660
...HIGH STRAIN RATE MECHANICAL PROPERTIES OF SAC-Q BETWEEN -65 OC AND +200 OC AFTER EXPOSURE TO ISOTHERMAL AGING Pradeep Lall1, Vishal Mehta1, Jeff Suhling1 1Auburn University, NSF-CAVE3 Electronics Research Center, Department of Mechanical Engineering, Auburn, AL 36849 Ken Blecker2 2US Army Combat...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019
Paper No: IPACK2019-6577
.... In this paper, evolution of microstructure and Anand parameters for unaged and aged SAC (SAC105 and SAC-Q) lead free solder alloys at high strain rates has been investigated induced due to thermal aging. The microstructure of the SAC solder is studied using scanning electron microscopy (SEM) for different...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 7–9, 2019
Paper No: IPACK2019-6576
...HIGH STRAIN RATE MECHANICAL PROPERTIES OF SAC-Q WITH SUSTAINED ELEVATED TEMPERATURE STORAGE AT 100OC Pradeep Lall1, Vishal Mehta1, Jeff Suhling1 1Auburn University, NSF-CAVE3 Electronics Research Center, Department of Mechanical Engineering, Auburn, AL 36849 David Locker2 2US Army Combat...