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Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Paper No: IPACK2022-97438
DOI: https://doi.org/10.1115/IPACK2022-97438
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Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry
Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Paper No: IPACK2021-74044
DOI: https://doi.org/10.1115/IPACK2021-74044
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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 26–28, 2021
Paper No: IPACK2021-73548
DOI: https://doi.org/10.1115/IPACK2021-73548
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Topics: Alloys, Creep, Lead-free solders, Stress-strain curves, Temperature
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Paper No: IPACK2020-2658
DOI: https://doi.org/10.1115/IPACK2020-2658
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Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines
Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 27–29, 2020
Paper No: IPACK2020-2660
DOI: https://doi.org/10.1115/IPACK2020-2660
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Topics: High temperature, Mechanical properties, Testing, Alloys, Operating temperature, Solders, Stress, Aerospace industry, Biomedicine, Electronic components
Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 7–9, 2019
Paper No: IPACK2019-6576
DOI: https://doi.org/10.1115/IPACK2019-6576
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Topics: Mechanical properties, Storage, Temperature, Alloys, Operating temperature, Electronic components, Electronics, High temperature, Lead-free solders, Shock (Mechanics)
Proceedings Papers

Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder

S. M. Kamrul Hasan, Abdullah Fahim, Jeffrey C. Suhling, Sa’d Hamasha, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 7–9, 2019
Paper No: IPACK2019-6563
DOI: https://doi.org/10.1115/IPACK2019-6563
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Topics: Cycles, Lead-free solders, Stress-strain curves, Tensile strength, Thermal shock
Proceedings Papers

Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 29–September 1, 2017
Paper No: IPACK2017-74300
DOI: https://doi.org/10.1115/IPACK2017-74300
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Topics: Alloys, Storage, High temperature, Solders, Temperature, Deformation, Electronics, Operating temperature, Constitutive equations, Elastic moduli
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Paper No: IPACK2015-48389
DOI: https://doi.org/10.1115/IPACK2015-48389
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Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Proceedings Papers

Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A002, July 6–9, 2015
Paper No: IPACK2015-48619
DOI: https://doi.org/10.1115/IPACK2015-48619
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Topics: Constitutive equations, Lead-free solders, Silver, Solidification, Alloys, Mechanical properties, Water, Solders, Reliability, Stress-strain curves
Proceedings Papers

Characterization of Doped SAC Solder Materials and Determination of Anand Parameters

Sudan Ahmed, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A003, July 6–9, 2015
Paper No: IPACK2015-48624
DOI: https://doi.org/10.1115/IPACK2015-48624
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Topics: Solders, Alloys, Reliability, Silver, Stress-strain curves, Temperature, Tin, Constitutive equations, Copper, Economics
Proceedings Papers

Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants

Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 749-761, July 6–8, 2011
Paper No: IPACK2011-52209
DOI: https://doi.org/10.1115/IPACK2011-52209
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Topics: Creep, Experimental characterization, Modeling, Temperature, Stress, Testing, Tension, Constitutive equations, Engineering simulation, Finite element analysis
Proceedings Papers

Characterization of Hysteresis Loop Evolution in Aged Lead Free Solders

Muhannad Mustafa, Zijie Cai, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 507-518, July 6–8, 2011
Paper No: IPACK2011-52186
DOI: https://doi.org/10.1115/IPACK2011-52186
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Topics: Lead-free solders, Stress-strain curves
Proceedings Papers

Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder

Kok Ee Tan, John H. L. Pang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 841-847, July 19–23, 2009
Paper No: InterPACK2009-89278
DOI: https://doi.org/10.1115/InterPACK2009-89278
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Topics: Lead-free solders, Solders, Yield stress, Stress-strain curves, Bone, Constitutive equations, Deformation, Elastic moduli, Finite element analysis, Mechanical properties
Proceedings Papers

Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies

Guoyun Tian, Chang Lin, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 789-796, July 19–23, 2009
Paper No: InterPACK2009-89209
DOI: https://doi.org/10.1115/InterPACK2009-89209
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Topics: Flip-chip, Flip-chip devices, Hardening (Curing), Laminates, Mechanical behavior, Reliability, Stress-strain curves
Proceedings Papers

Material Behavior of Mixed Formulation Solder Joints

Yifei Zhang, Kanth Kurumaddali, Jeffrey C. Suhling, Pradeep Lall, Michael J. Bozack
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 335-346, July 19–23, 2009
Paper No: InterPACK2009-89003
DOI: https://doi.org/10.1115/InterPACK2009-89003
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Topics: Solder joints, Solders, Alloys, Tin, Ball-Grid-Array packaging, Creep, Mechanical properties, Temperature, Electronics, Manufacturing industry
Proceedings Papers

Molecular Dynamic Simulation of Crack Propagation Behavior in Nano Size HCP Crystals

Shinji Ando, Leping Bu, Masayuki Tsushida, Hideki Tonda
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1685-1688, July 17–22, 2005
Paper No: IPACK2005-73042
DOI: https://doi.org/10.1115/IPACK2005-73042
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Topics: Crack propagation, Crystals, Molecular dynamics, Simulation, Fracture (Materials), Microelectromechanical systems, Molecular dynamics methods, Shear (Mechanics), Stress, Stress-strain curves