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Proceedings Papers

Effects of Grain to Sample Volume Ratio on the Deformation Behavior of Polycrystal SAC Samples Subjected to Shear Loads

Debabrata Mondal, Jeffrey C. Suhling, Elham Mirkoohi, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112034
https://doi.org/10.1115/IPACK2023-112034
View Paper titled, Effects of Grain to Sample Volume Ratio on the Deformation Behavior of Polycrystal SAC Samples Subjected to Shear Loads
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Topics: Crystals, Deformation, Dislocations, Plasticity, Shear (Mechanics), Stress
Proceedings Papers

Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

Pradeep Lall, Aathi Raja Ram Pandurangan, Madhu Katsuri
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
https://doi.org/10.1115/IPACK2023-111937
View Paper titled, Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model
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Topics: Architecture, Automobiles, Ball-Grid-Array packaging, Delamination, Electronics, Engines, Failure, Failure mechanisms, Fatigue, Finite element model
Proceedings Papers

Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing

Whit Vinson, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111909
https://doi.org/10.1115/IPACK2023-111909
View Paper titled, Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing
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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress
Proceedings Papers

Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, David Locker
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112036
https://doi.org/10.1115/IPACK2023-112036
View Paper titled, Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage
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Topics: Operating temperature, Solders, Storage, Alloys, Constitutive equations, Shock (Mechanics), Temperature, Aerospace industry, Automobiles, Climate
Proceedings Papers

Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework

Pradeep Lall, Padmanava Choudhury, Aathi Raja Ram Pandurangan
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112014
https://doi.org/10.1115/IPACK2023-112014
View Paper titled, Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework
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Topics: Elastic moduli, Glass, Manufacturing, Resins, Stress, Tensile strength
Proceedings Papers

Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink

Pradeep Lall, Sabina Bimali, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112066
https://doi.org/10.1115/IPACK2023-112066
View Paper titled, Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink
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Topics: Adhesives, Aerosols, Failure, Inks, Printing, Shear (Mechanics), Silver, Sintering, Stress, Sustainability
Proceedings Papers

Characterization of SAC305 Solder Joints Under Elevated Current, Temperature, and Varying Shear Stress Conditions

Collin Ruby, David R. Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113756
https://doi.org/10.1115/IPACK2023-113756
View Paper titled, Characterization of SAC305 Solder Joints Under Elevated Current, Temperature, and Varying Shear Stress Conditions
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Topics: Reliability, Shear stress, Solder joints, Stress, Temperature
Proceedings Papers

Propensity for Fatigue Failure of the FCBGA UF-Substrate Interface After Prolonged Storage

Pradeep Lall, Padmanava Choudhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112052
https://doi.org/10.1115/IPACK2023-112052
View Paper titled, Propensity for Fatigue Failure of the FCBGA UF-Substrate Interface After Prolonged Storage
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Topics: Fatigue failure, Storage, Failure, Reliability, Electronics, Temperature, Cycles, Fatigue, Flip-chip, Stress
Proceedings Papers

Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage

Michael Shanks, Uduak Inyang-Udoh, Neera Jain
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111816
https://doi.org/10.1115/IPACK2023-111816
View Paper titled, Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage
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Topics: Thermal energy storage, Thermal management, Transients (Dynamics), Control equipment, Heat, Simulation, Architecture, Computer cooling, Feedback, Fluids
Proceedings Papers

Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors

Josef Frankhouse, Jackson Marsh, Han Hu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111922
https://doi.org/10.1115/IPACK2023-111922
View Paper titled, Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors
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Topics: Acoustic emissions, Condition monitoring, Semiconductors (Materials), Sensors, Electric vertical take-off and landing aircraft, Electronics, Aircraft, Density, Electric vehicles, Electromagnetic interference
Proceedings Papers

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113883
https://doi.org/10.1115/IPACK2023-113883
View Paper titled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates
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Topics: Experimental characterization, Metrology, Plates (structures), Temperature, Thermal resistance, Engineering simulation, Errors, Simulation, Uncertainty, Boundary-value problems
Proceedings Papers

Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer

Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111958
https://doi.org/10.1115/IPACK2023-111958
View Paper titled, Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer
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Topics: Aerosols, Failure, Inks, Nanoparticles, Shear (Mechanics), Silver, Stress, Sustainability, Water
Proceedings Papers

Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit

Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112064
https://doi.org/10.1115/IPACK2023-112064
View Paper titled, Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit
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Topics: Adhesives, Aerosols, Circuits, Failure, Inks, Shear (Mechanics), Silver, Stress, Sustainability
Proceedings Papers

Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

Pradeep Lall, Yunli Zhang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
https://doi.org/10.1115/IPACK2023-112070
View Paper titled, Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
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Topics: Copper, Delamination, Fatigue, Fatigue cracks, Fracture (Materials), Fracture toughness, High temperature, Stress, Surface finishing, Low cycle fatigue
Proceedings Papers

The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8405
https://doi.org/10.1115/IPACK2018-8405
View Paper titled, The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials
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Topics: Hardening (Curing), Mechanical behavior, Solder masks, Temperature, Ultraviolet radiation, Creep, Mechanical properties, Elastic moduli, Stress, Tensile testing
Proceedings Papers

In-Plane Pre-Stress Analysis for Automotive Airbag Electronic Control Unit’s Printed Circuit Board Transverse Vibration

Guo Xiaochuan
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8214
https://doi.org/10.1115/IPACK2018-8214
View Paper titled, In-Plane Pre-Stress Analysis for Automotive Airbag Electronic Control Unit’s Printed Circuit Board Transverse Vibration
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Topics: Airbags, Printed circuit boards, Stress, Vibration, Design, Simulation, Simulation models, Finite element analysis, Manufacturing, Plate theory
Proceedings Papers

Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications

Suresh Parameswaran, Gamal Refai-Ahmed, Suresh Ramalingam, Boon Ang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8300
https://doi.org/10.1115/IPACK2018-8300
View Paper titled, Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications
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Topics: Internet of things, Stress, Vehicles, Circuits, Computer software, Cooling, Cycles, Energy dissipation, Flip-chip packages, Modeling
Proceedings Papers

Thermal Interface Materials Enhanced by Micro and Nanostructures

Mei-Chien Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8307
https://doi.org/10.1115/IPACK2018-8307
View Paper titled, Thermal Interface Materials Enhanced by Micro and Nanostructures
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Topics: Architecture, Corners (Structural elements), Design, Electronic packages, Electronics, Energy gap, Failure, Finite element methods, High temperature, Nanostructures
Proceedings Papers

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8305
https://doi.org/10.1115/IPACK2018-8305
View Paper titled, Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling
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Topics: Cooling, Data centers, Energy efficiency, Temperature, Stress, Energy consumption, Internet of things, Air conditioning, Air flow, Cloud computing
Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8345
https://doi.org/10.1115/IPACK2018-8345
View Paper titled, Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)
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Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design