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Proceedings Papers
Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Paper No: IPACK2020-2541
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 7–9, 2019
Paper No: IPACK2019-6386
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 29–September 1, 2017
Paper No: IPACK2017-74030
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A009, July 6–9, 2015
Paper No: IPACK2015-48288