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Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022

Paper No: IPACK2022-97456

DOI: https://doi.org/10.1115/IPACK2022-97456

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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding

Proceedings Papers

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021

Paper No: IPACK2021-73348

DOI: https://doi.org/10.1115/IPACK2021-73348

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Topics: Intermetallic compounds, Lead-free solders, Solder joints, Alloys, Reliability, Copper, Elastic moduli, Electronic packaging, Nanoindentation, Polishing

Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021

Paper No: IPACK2021-74044

DOI: https://doi.org/10.1115/IPACK2021-74044

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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature

Proceedings Papers

Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading

Abdullah Fahim, Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 27–29, 2020

Paper No: IPACK2020-2655

DOI: https://doi.org/10.1115/IPACK2020-2655

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Topics: Creep, Nanoindentation, Solder masks

Proceedings Papers

Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading

Abdullah Fahim, S. M. Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 7–9, 2019

Paper No: IPACK2019-6471

DOI: https://doi.org/10.1115/IPACK2019-6471

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Topics: Creep, Nanoindentation, Solder joints, Testing

Proceedings Papers

Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints

Mohd Aminul Hoque, Md Mahmudur Chowdhury, Sa’d Hamasha, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 7–9, 2019

Paper No: IPACK2019-6567

DOI: https://doi.org/10.1115/IPACK2019-6567

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Topics: Creep, Lead-free solders, Mechanical properties, Nanoindentation, Shear (Mechanics)

Proceedings Papers

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

Abdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 27–30, 2018

Paper No: IPACK2018-8408

DOI: https://doi.org/10.1115/IPACK2018-8408

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Topics: Lead-free solders, Mechanical properties, Nanoindentation, Tin, Solder joints, Particulate matter, Composite materials, Creep, Deformation, Elastic moduli

Proceedings Papers

Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

Erick Gutierrez, Subramani Manoharan, Maxim Serebreni, Patrick McCluskey

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A018, August 27–30, 2018

Paper No: IPACK2018-8392

DOI: https://doi.org/10.1115/IPACK2018-8392

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Topics: Tension-leg platforms, Tin, Transients (Dynamics), Alloys, High temperature, Nanoindentation, Shear (Mechanics), Stress, Copper, Electronic systems

Proceedings Papers

Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder

Nianjun Fu, Jing Wu, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, August 29–September 1, 2017

Paper No: IPACK2017-74266

DOI: https://doi.org/10.1115/IPACK2017-74266

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Topics: Lead-free solders, Tin, Cross section (Physics), Microscopy, Particulate matter, Cooling, Intermetallic compounds, Nanoindentation, Polishing, Scanning electron microscopy

Proceedings Papers

Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints

Md Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A008, July 6–9, 2015

Paper No: IPACK2015-48623

DOI: https://doi.org/10.1115/IPACK2015-48623

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Topics: Silver, Solder joints, Creep, Alloys, Solders, Nanoindentation, Testing, Crystal structure, Crystals, Stress

Proceedings Papers

Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM

Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A003, July 16–18, 2013

Paper No: IPACK2013-73126

DOI: https://doi.org/10.1115/IPACK2013-73126

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Topics: Finite element methods, Reliability, Temperature, Finite element analysis, Resins, Electronic packages, Hardening (Curing), Heat, Integrated circuits, Materials properties

Proceedings Papers

Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging

Mohammad Hasnine, Muhannad Mustafa, Jing Zou, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall

Paper No: IPACK2013-73234

DOI: https://doi.org/10.1115/IPACK2013-73234

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Topics: Creep, Electron backscatter diffraction, Microelectronic packaging, Nanoindentation, Solder joints

Proceedings Papers

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic

Soud Farhan Choudhury, Leila Ladani

Paper No: IPACK2013-73315

DOI: https://doi.org/10.1115/IPACK2013-73315

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Topics: Crystals, Intermetallic compounds, Mechanical behavior, Tin, Solder joints, Electron backscatter diffraction, Nanoindentation, Anisotropy, Creep, Ductility

Proceedings Papers

Peridynamic Theory for Simulation of Failure Mechanisms in Electronic Packages

Erkan Oterkus, Abigail Agwai, Ibrahim Guven, Erdogan Madenci

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 63-68, July 19–23, 2009

Paper No: InterPACK2009-89107

DOI: https://doi.org/10.1115/InterPACK2009-89107

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Topics: Electronic packages, Failure mechanisms, Simulation, Crack propagation, Graphene, Thin films, Molecular dynamics, Nanoindentation, Simulation results

Proceedings Papers

Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder

Kok Ee Tan, John H. L. Pang

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 841-847, July 19–23, 2009

Paper No: InterPACK2009-89278

DOI: https://doi.org/10.1115/InterPACK2009-89278

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Topics: Lead-free solders, Solders, Yield stress, Stress-strain curves, Bone, Constitutive equations, Deformation, Elastic moduli, Finite element analysis, Mechanical properties

Proceedings Papers

Micro Texture-Induced Variation of Mechanical Properties of Electroplated Copper Thin Films

Muneyuki Otani, Kazuhiko Sakutani, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 735-741, July 8–12, 2007

Paper No: IPACK2007-33261

DOI: https://doi.org/10.1115/IPACK2007-33261

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Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Young's modulus, Bulk solids, Grain boundaries, Cold rolling, Deformation, Elasticity

Proceedings Papers

Mechanical Properties of Lead Free Solder Alloy Measured by Nanoindentation

Y. Sun, Z. H. Xu, X. Li, D. Shangguan, J. Liang

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 415-421, July 8–12, 2007

Paper No: IPACK2007-33988

DOI: https://doi.org/10.1115/IPACK2007-33988

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Topics: Alloys, Lead-free solders, Mechanical properties, Nanoindentation, Temperature, Creep, Deformation, Electronics, Mechanical behavior, Microhardness

Proceedings Papers

Indentation Induced Tin Whisker Formation on Tin Plated Component Leads

Jin Liang, Xiaodong Li, Zhi-Hui Xu, Dongkai Shangguan

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1199-1205, July 17–22, 2005

Paper No: IPACK2005-73233

DOI: https://doi.org/10.1115/IPACK2005-73233

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Topics: Coating processes, Coatings, Deformation, Elastic moduli, Finishes, Finite element analysis, Nanoindentation, Nucleation (Physics), Plating, Reliability

Proceedings Papers

Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder Alloys

Changqing Liu, David A. Hutt, Dezhi Li, Paul P. Conway

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1819-1825, July 17–22, 2005

Paper No: IPACK2005-73160

DOI: https://doi.org/10.1115/IPACK2005-73160

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Topics: Alloys, Lead-free solders, Nickel, Coatings, Tin, Storage, Temperature, Testing, Copper, Mechanical properties

Proceedings Papers

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Changqing Liu, Paul Conway, Dezhi Li, Michael Hendriksen

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 147-153, July 6–11, 2003

Paper No: IPACK2003-35130

DOI: https://doi.org/10.1115/IPACK2003-35130

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Topics: Flip-chip, Flip-chip devices, Solders, Manufacturing, Brittleness, Reliability, Shear (Mechanics), Shear strength, Testing, Tin

NARROW

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading

Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading

Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder

Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints

Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM

Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic

Peridynamic Theory for Simulation of Failure Mechanisms in Electronic Packages

Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder

Micro Texture-Induced Variation of Mechanical Properties of Electroplated Copper Thin Films

Mechanical Properties of Lead Free Solder Alloy Measured by Nanoindentation

Indentation Induced Tin Whisker Formation on Tin Plated Component Leads

Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder Alloys

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

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