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Proceedings Papers

Transient Performance and Melt Front Characterization of Phase Change Materials

Tyler Stamps, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 26–28, 2021
Paper No: IPACK2021-73252
DOI: https://doi.org/10.1115/IPACK2021-73252
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Topics: Phase change materials, Transients (Dynamics), Matlab, Temperature, Computation, Computer simulation, Convection, Finite element analysis, Heat, Heat flux
Proceedings Papers

Power Packaging Thermal and Stress Model for Quick Parametric Analyses

L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 29–September 1, 2017
Paper No: IPACK2017-74130
DOI: https://doi.org/10.1115/IPACK2017-74130
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Topics: Packaging, Stress, Finite element analysis, Design, Matlab, Temperature, Thermal stresses, Computer-aided design, Resistors, Computer-aided engineering
Proceedings Papers

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 29–September 1, 2017
Paper No: IPACK2017-74264
DOI: https://doi.org/10.1115/IPACK2017-74264
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Topics: Printed circuit boards, Reliability, Solders, X-rays, Deformation, Electronics, Manufacturing, Solder joints, Computerized tomography, Heating
Proceedings Papers

Design of the Next Generation Antenna Mounts

Ruben Gregory Puthota Dominic Savio, Betsegaw Gebrehiwot, Dereje Agonafer, Al Skrepcinski, Tom Palmer
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A007, July 6–9, 2015
Paper No: IPACK2015-48594
DOI: https://doi.org/10.1115/IPACK2015-48594
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Topics: Design, Telecommunications, Weight (Mass), Deformation, Image processing, Load bearing capacity, Matlab, Stress, Wind pressure
Proceedings Papers

Thermodynamic Modeling of Data Center Cooling Systems

A. P. Wemhoff, M. del Valle, K. Abbasi, A. Ortega
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A008, July 16–18, 2013
Paper No: IPACK2013-73116
DOI: https://doi.org/10.1115/IPACK2013-73116
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Topics: Cooling systems, Data centers, Modeling, Flow (Dynamics), Air conditioning, Air flow, Design, Exergy, Fluid mechanics, Heat transfer
Proceedings Papers

Server Heat Load Based CRAC Fan Controller Paired With Rear Door Heat Exchanger

Vikneshan Sundaralingam, Pramod Kumar, Yogendra Joshi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 489-496, July 6–8, 2011
Paper No: IPACK2011-52114
DOI: https://doi.org/10.1115/IPACK2011-52114
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Topics: Control equipment, Doors, Heat, Heat exchangers, Stress, Cooling, Data centers, Air conditioning, Blades, Computer software
Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009
Paper No: InterPACK2009-89092
DOI: https://doi.org/10.1115/InterPACK2009-89092
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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization