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Proceedings Papers

Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Andy Clark, Xuemei Cheng, Lu An, Ezra Lee, Xiaosong Liu, Gang Feng
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 26–28, 2021
Paper No: IPACK2021-66842
DOI: https://doi.org/10.1115/IPACK2021-66842
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Topics: Electrical conductance, Thermoreflectance, Transducers, Thermal resistance, Architecture, Computer simulation, Electronic packaging, Fittings, Flow (Dynamics), Geometry
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Paper No: IPACK2020-2541
DOI: https://doi.org/10.1115/IPACK2020-2541
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 29–September 1, 2017
Paper No: IPACK2017-74300
DOI: https://doi.org/10.1115/IPACK2017-74300
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Topics: Alloys, Storage, High temperature, Solders, Temperature, Deformation, Electronics, Operating temperature, Constitutive equations, Elastic moduli
Proceedings Papers

Measuring Moisture Leakage Out of Water Cooling Hardware

Prabjit Singh, Michael Ellsworth
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Paper No: IPACK2015-48154
DOI: https://doi.org/10.1115/IPACK2015-48154
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Topics: Cooling, Hardware, Leakage, Water, Computers, Cooling systems, Electronics, Acoustics, Coolants, Errors
Proceedings Papers

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)

Pushkraj Tumne, Vikram Venkatadri, Santosh Kudtarkar, Michael Delaus, Daryl Santos, Ross Havens, Krishnaswami Srihari
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 713-721, July 6–8, 2011
Paper No: IPACK2011-52078
DOI: https://doi.org/10.1115/IPACK2011-52078
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Topics: Design, Semiconductor wafers, Solders, Reliability, Electronics, Failure, Flip-chip, Intermetallic compounds, Brittle fracture, Failure mechanisms
Proceedings Papers

A Fundamental Approach to Modeling Transport to an Impinging Spray

Andrea C. Ashwood, Curtis Lane, Benjamin M. Regner, Timothy A. Shedd
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 267-272, July 8–12, 2007
Paper No: IPACK2007-33898
DOI: https://doi.org/10.1115/IPACK2007-33898
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Topics: Modeling, Sprays, Liquid films, Computer simulation, Fittings, Simulation, Computational fluid dynamics, Drops, Fluids, Jets
Proceedings Papers

Determination of the Anand Viscoplasticity Model Constants for SnAgCu

Bryan Rodgers, Ben Flood, Jeff Punch, Finbarr Waldron
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1263-1270, July 17–22, 2005
Paper No: IPACK2005-73352
DOI: https://doi.org/10.1115/IPACK2005-73352
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Topics: Alloys, ASTM International, Ball-Grid-Array packaging, Bone, Computer software, Constitutive equations, Displacement, Fatigue life, Finite element model, Fittings
Proceedings Papers

Automatic Thermal Modeling for System Level Design of Electronic Equipment

Kenichiro Aoki, Koichi Shimizu, Akira Ueda, Akira Tamura, Masanori Motegi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 357-362, July 6–11, 2003
Paper No: IPACK2003-35161
DOI: https://doi.org/10.1115/IPACK2003-35161
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Topics: Computer software, Design, Electronic equipment, Fittings, Hardware, Modeling, Numerical analysis, Product development, Simulation, Thermofluids