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Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021

Paper No: IPACK2021-73456

DOI: https://doi.org/10.1115/IPACK2021-73456

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Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis

Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021

Paper No: IPACK2021-73253

DOI: https://doi.org/10.1115/IPACK2021-73253

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Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)

Proceedings Papers

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices

Alex Davila-Frias, Val Marinov, Om Prakash Yadav, Yuriy Atanasov

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 27–29, 2020

Paper No: IPACK2020-2525

DOI: https://doi.org/10.1115/IPACK2020-2525

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Topics: Design, Electronics, Failure analysis, Temperature, Stress, Failure, Testing, Accelerated life testing, Chain, Failure data

Proceedings Papers

Folding-Reliability of Flexible Electronics in Wearable Applications

Pradeep Lall, Hyesoo Jang, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, October 7–9, 2019

Paper No: IPACK2019-6584

DOI: https://doi.org/10.1115/IPACK2019-6584

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Topics: Fatigue life, Flexible electronics, Reliability, Electronics, Stress, Failure mechanisms, Experimental analysis, Failure analysis, Robustness, Skin

Proceedings Papers

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Dag Andersson, Zsolt Toth-Pal, Mattias Forslund, Samer Shisha

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A016, August 27–30, 2018

Paper No: IPACK2018-8385

DOI: https://doi.org/10.1115/IPACK2018-8385

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Topics: Failure mechanisms, Electronics, Reliability, Acoustics, Automotive industry, Cooling, Elastic moduli, Failure analysis, Heating, High temperature

Proceedings Papers

Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 27–30, 2018

Paper No: IPACK2018-8443

DOI: https://doi.org/10.1115/IPACK2018-8443

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Topics: Cooling, Cooling systems, Data centers, Failure analysis, Failure, Temperature, Coolants, Heat

Proceedings Papers

Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Bharath Ramakrishnan, Bahgat Sammakia

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, August 29–September 1, 2017

Paper No: IPACK2017-74174

DOI: https://doi.org/10.1115/IPACK2017-74174

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Topics: Cooling systems, Data centers, Failure analysis, Failure, Temperature, Coolants, Cooling, Fans, High temperature, Leakage

Proceedings Papers

Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling

Uschas Chowdhury, Manasa Sahini, Ashwin Siddarth, Dereje Agonafer, Steve Branton

Paper No: IPACK2017-74028

DOI: https://doi.org/10.1115/IPACK2017-74028

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Topics: Cooling, Failure, Water, Energy consumption, Fans, Pumps, Data centers, Density, Heat, Redundancy (Engineering)

Proceedings Papers

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

Pradeep Lall, Amrit Abrol, David Locker

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A022, August 29–September 1, 2017

Paper No: IPACK2017-74252

DOI: https://doi.org/10.1115/IPACK2017-74252

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Topics: Microelectromechanical systems, Microphones, Reliability, Temperature, High temperature, Service life (Equipment), Analytical methods, Engineers, Failure analysis, Failure mechanisms

Proceedings Papers

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A007, August 29–September 1, 2017

Paper No: IPACK2017-74073

DOI: https://doi.org/10.1115/IPACK2017-74073

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Topics: Delamination, Electronic packaging, Fracture (Materials), Simulation, Electronic packages, Copper, Finite element analysis, Fracture mechanics, Risk, Stress

Proceedings Papers

Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs

Pradeep Lall, Shantanu Deshpande, Luu Nguyen

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A004, July 6–9, 2015

Paper No: IPACK2015-48638

DOI: https://doi.org/10.1115/IPACK2015-48638

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Topics: Aluminum, Copper, Wire, Temperature, Chemistry, Compression, Failure analysis, Image processing, Metals, Molding

Proceedings Papers

Transient Liquid Phase Sintered Joints for Power Electronic Modules

Hannes Greve, F. Patrick McCluskey

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A004, July 16–18, 2013

Paper No: IPACK2013-73209

DOI: https://doi.org/10.1115/IPACK2013-73209

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Topics: Transients (Dynamics), Melting point, Metals, Shear strength, Sinter (Metallurgy), Temperature, Copper, Shear (Mechanics), Tension-leg platforms, Binders (Materials)

Proceedings Papers

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

Adam Pearl, Michael Osterman

Paper No: IPACK2013-73278

DOI: https://doi.org/10.1115/IPACK2013-73278

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Topics: Printed circuit boards, Solders, Finishes, Failure mechanisms, Lumber, Reliability, Cracking (Materials), Fracture (Process), Resistors, Shock (Mechanics)

Proceedings Papers

A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance

Kazuaki Yazawa, Dustin Kendig, James Christofferson, Ali Shakouri

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A023, July 16–18, 2013

Paper No: IPACK2013-73104

DOI: https://doi.org/10.1115/IPACK2013-73104

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Topics: Electron emission, Failure analysis, Imaging, Thermoreflectance, Circuits, Emissions, Failure, Electrons, Silicon, Temperature

Proceedings Papers

Effects of TSV Interposer on the Reliability of 3D IC Integration SiP

John H. Lau, Xiaowu Zhang

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 65-73, July 6–8, 2011

Paper No: IPACK2011-52205

DOI: https://doi.org/10.1115/IPACK2011-52205

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Topics: Reliability, Corners (Structural elements), Creep, Cycles, Density, Failure analysis, Silicon, Solder joints, Stress, System-in-package

Proceedings Papers

Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling

Da Yu, Tung Nguyen, Ho H. Lee, Namseo Goo, S. B. Park

Paper No: IPACK2011-52232

DOI: https://doi.org/10.1115/IPACK2011-52232

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Topics: Reliability, Heat, Heat sinks, Power density, Solder joints, Circuits, Computer simulation, Cycles, Energy dissipation, Experimental methods

Proceedings Papers

Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory

Dennis Chan, Dhruv Bhate, Ganesh Subbarayan, Luu Nguyen

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 199-205, July 19–23, 2009

Paper No: InterPACK2009-89402

DOI: https://doi.org/10.1115/InterPACK2009-89402

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Topics: Fracture (Materials), Cycles, Failure analysis, Finite element model, Geometry, Solder joints, Solders, Computer software, Corners (Structural elements), Creep

Proceedings Papers

Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes

G. Srinivasan, R. Murcko, K. Srihari

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 283-292, July 19–23, 2009

Paper No: InterPACK2009-89241

DOI: https://doi.org/10.1115/InterPACK2009-89241

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Topics: Finishes, Plating, Wire, Nickel, Palladium, Silver, Failure analysis, High temperature, Manufacturing, Reliability

Proceedings Papers

Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

Salil Pradhan, Francois Billaut, Sunil Gopakumar

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 321-328, July 19–23, 2009

Paper No: InterPACK2009-89405

DOI: https://doi.org/10.1115/InterPACK2009-89405

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Topics: Manufacturing, Reliability, Lumber, Pins (Engineering), Ball-Grid-Array packaging, Construction, Cross section (Physics), Design, Experimental design, Failure analysis

Proceedings Papers

The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading

Kayleen L. E. Helms, Ketan R. Shah, Dan Gerbus, Vasu S. Vasudevan, Jagadeesh Radhakrishnan, Will Berry

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 945-951, July 19–23, 2009

Paper No: InterPACK2009-89347

DOI: https://doi.org/10.1115/InterPACK2009-89347

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Topics: Ball-Grid-Array packaging, Damage, Electronic packages, Flip-chip, Shock (Mechanics), Design, Risk, Solder joints, Accelerated life testing, Alloys

NARROW

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices

Folding-Reliability of Flexible Electronics in Wearable Applications

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers

Failure Analysis of Direct Liquid Cooling System in Data Centers

Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs

Transient Liquid Phase Sintered Joints for Power Electronic Modules

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance

Effects of TSV Interposer on the Reliability of 3D IC Integration SiP

Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling

Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory

Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes

Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading

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