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Proceedings Papers

Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data

Rémy Haynau, Jackson B. Marcinichen, Raffaele L. Amalfi, Filippo Cataldo, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 26–28, 2021
Paper No: IPACK2021-72620
DOI: https://doi.org/10.1115/IPACK2021-72620
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Topics: Cooling systems, Heat flux, Simulation
Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Paper No: IPACK2021-72621
DOI: https://doi.org/10.1115/IPACK2021-72621
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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat
Proceedings Papers

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

Eric Peterson, Seth Morris, Husam Alissa, Nicholas Keehn, Bharath Ramakrishnan, Vaidehi Oruganti, Ioannis Manousakis, Noah Mckay
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 26–28, 2021
Paper No: IPACK2021-72682
DOI: https://doi.org/10.1115/IPACK2021-72682
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Topics: Boilers, Carbon, Condensers (steam plant), Cooling, Cooling systems, Emissions, Energy consumption, Film thickness, Fluids, Gases
Proceedings Papers

An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems

Alexander V. Korobko, Sana Fateh
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 26–28, 2021
Paper No: IPACK2021-68121
DOI: https://doi.org/10.1115/IPACK2021-68121
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Topics: Cooling systems, Heat transfer, Nanofluids, Heat, Critical heat flux, Data centers, Fluids, Thermal management, Boiling, Computation
Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Paper No: IPACK2021-72612
DOI: https://doi.org/10.1115/IPACK2021-72612
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Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design
Proceedings Papers

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles

Bidzina Kekelia, J. Emily Cousineau, Kevin Bennion, Sreekant Narumanchi, Shajjad Chowdhury
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 27–29, 2020
Paper No: IPACK2020-2524
DOI: https://doi.org/10.1115/IPACK2020-2524
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Topics: Electric vehicles, Thermal management, Traction, Electronics, Machinery, Cooling, Cooling systems, Engines, Finite element analysis, Fluids
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Paper No: IPACK2020-2541
DOI: https://doi.org/10.1115/IPACK2020-2541
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Paper No: IPACK2020-2542
DOI: https://doi.org/10.1115/IPACK2020-2542
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Personal Heating/Cooling System Using Peltier

Amanie Abdelmessih, Andre Alvarez, Joshua Gonzalez, Timothy Gooch, Adrian Gutierrez, Kristoffer Magana, Jonathan Nakamura, Joseph van Haaster
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 27–29, 2020
Paper No: IPACK2020-2625
DOI: https://doi.org/10.1115/IPACK2020-2625
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Topics: Cooling, Cooling systems, Heating
Proceedings Papers

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

Shuai Shao, Tianyi Gao, Huawei Yang, Jie Zhao, Jiajun Zhang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 27–29, 2020
Paper No: IPACK2020-2670
DOI: https://doi.org/10.1115/IPACK2020-2670
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Topics: Coolants, Cooling, Cooling systems, Fluids, Graphics processing units, Power density, Data centers, Temperature, Decision making, Density
Proceedings Papers

Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Pedro O. Quintero, Lauren M. Boteler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019
Paper No: IPACK2019-6385
DOI: https://doi.org/10.1115/IPACK2019-6385
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Topics: Cooling, Cycles, Melting, Solidification, Stability, Thermal stability, Alloys, Metals, Temperature, Thermal management
Proceedings Papers

Design of Passive Two-Phase Thermosyphons for Server Cooling

Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Filippo Cataldo
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 7–9, 2019
Paper No: IPACK2019-6386
DOI: https://doi.org/10.1115/IPACK2019-6386
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Topics: Cooling, Design, Energy consumption, Heat, Cooling systems, Artificial intelligence, Condensers (steam plant), Coolants, Databases, Electric vehicles
Proceedings Papers

Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 27–30, 2018
Paper No: IPACK2018-8443
DOI: https://doi.org/10.1115/IPACK2018-8443
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Topics: Cooling, Cooling systems, Data centers, Failure analysis, Failure, Temperature, Coolants, Heat
Proceedings Papers

Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation

Mohammad Tradat, Bahgat Sammakia, Husam Alissa, Kourosh Nemati
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 27–30, 2018
Paper No: IPACK2018-8334
DOI: https://doi.org/10.1115/IPACK2018-8334
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Topics: Cooling, Data centers, Experimental analysis, Failure, Instrumentation, Cooling systems, Temperature, Containment, Equipment performance, Pressure
Proceedings Papers

Weather Analysis Using Neural Networks for Modular Data Centers

Feyisola Adejokun, Ashwin Siddarth, Abhishek Guhe, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 27–30, 2018
Paper No: IPACK2018-8253
DOI: https://doi.org/10.1115/IPACK2018-8253
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Topics: Artificial neural networks, Data centers, Cooling, Evaporative cooling, Cooling systems, Neural network models, Temperature, Algorithms, Computation, Control systems
Proceedings Papers

Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

Ruikang Wu, Wei Lan, Xingjian Yu, Weicheng Shu, Meng Wang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 27–30, 2018
Paper No: IPACK2018-8210
DOI: https://doi.org/10.1115/IPACK2018-8210
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Topics: Flow (Dynamics), Micropumps, Fluid dynamics, Pressure, Journal bearings, Pumps, Rotors, Bearings, Cooling, Cooling systems
Proceedings Papers

Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems

Manasa Sahini, Dereje Agonafer, Vijayalan Pandiyan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, August 29–September 1, 2017
Paper No: IPACK2017-74016
DOI: https://doi.org/10.1115/IPACK2017-74016
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Topics: Computational fluid dynamics, Containment, Cooling, Cooling systems, Data centers, Design, Exhaust systems, Fans, Flow (Dynamics), Hardware
Proceedings Papers

Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Bharath Ramakrishnan, Bahgat Sammakia
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, August 29–September 1, 2017
Paper No: IPACK2017-74174
DOI: https://doi.org/10.1115/IPACK2017-74174
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Topics: Cooling systems, Data centers, Failure analysis, Failure, Temperature, Coolants, Cooling, Fans, High temperature, Leakage
Proceedings Papers

Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel

David C. Deisenroth, Avram Bar-Cohen, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A025, August 29–September 1, 2017
Paper No: IPACK2017-74287
DOI: https://doi.org/10.1115/IPACK2017-74287
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Topics: Geometry, Two-phase flow, Cooling, Heat, Boiling, Evaporation, Flow (Dynamics), Manifolds, Cooling systems, Design
Proceedings Papers

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Todd Salamon
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 29–September 1, 2017
Paper No: IPACK2017-74020
DOI: https://doi.org/10.1115/IPACK2017-74020
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Topics: Cooling systems, Electronics, Experimental analysis, Secondary cells, Boiling, Computer cooling, Condensers (steam plant), Cooling, Cylinders, Electronic components