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Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Paper No: IPACK2020-2605
DOI: https://doi.org/10.1115/IPACK2020-2605
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Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

Arun V. Gowda, Rinaldo L. Miorini, Michael Fish, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 27–29, 2020
Paper No: IPACK2020-2608
DOI: https://doi.org/10.1115/IPACK2020-2608
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Topics: Silicon, Steady state, Transients (Dynamics), Additive manufacturing, Flow (Dynamics), Army, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paul Paret, Joshua Major, Douglas DeVoto, Sreekant Narumanchi, Yansong Tan, Guo-Quan Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 27–30, 2018
Paper No: IPACK2018-8276
DOI: https://doi.org/10.1115/IPACK2018-8276
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Topics: Silver, Particulate matter, Pressure, Collaboration, Displacement, Electronics, Energy gap, High pressure (Physics), High temperature, Manufacturing
Proceedings Papers

Consideration for Running Data Center at High Temperatures and Using Free Air Cooling

Yongzhan He, Guofeng Chen, Jiajun Zhang, Tianyu Zhou, Tao Liu, Pinyan Zhu, Chao Liu, Nishi Ahuja
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A014, July 6–9, 2015
Paper No: IPACK2015-48169
DOI: https://doi.org/10.1115/IPACK2015-48169
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Topics: Cooling, Data centers, High temperature, Corrosion, Internet, Temperature, Design, Operating temperature, Refrigeration, Carbon dioxide
Proceedings Papers

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

Koichi Mashiko, Masataka Mochizuki, Kazuhiko Goto, Makoto Takahashi, Masahiro Matsuda, Yasuhiro Horiuchi, Tien Nguyen
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A001, July 16–18, 2013
Paper No: IPACK2013-73028
DOI: https://doi.org/10.1115/IPACK2013-73028
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Topics: Cooling, Electronics, Microchannels, Computers, Water, Brazing, Cooling systems, Data centers, Collaboration, Design
Proceedings Papers

Integrated Design and Management of a Sustainable Data Center

Brian J. Watson, Amip J. Shah, Manish Marwah, Cullen E. Bash, Ratnesh K. Sharma, Christopher E. Hoover, Tom W. Christian, Chandrakant D. Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 635-644, July 19–23, 2009
Paper No: InterPACK2009-89032
DOI: https://doi.org/10.1115/InterPACK2009-89032
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Topics: Data centers, Design, Sustainability, Blocks (Building materials), Collaboration, Visualization
Proceedings Papers

Development of a Miniature Vapor Compression Refrigeration System for Electronic Cooling

Gareth F. Davies, Ian W. Eames, Paul B. Bailey, Michael W. Dadd, Adam Janiszewski, C. Richard Stone, Graeme G. Maidment, Brian Agnew
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 399-408, July 19–23, 2009
Paper No: InterPACK2009-89162
DOI: https://doi.org/10.1115/InterPACK2009-89162
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Topics: Compression, Computer cooling, Refrigeration, Vapors, Compressors, Cooling, Heat, Heat exchangers, Porous materials, Transients (Dynamics)
Proceedings Papers

The Thermal-Circuit High-Speed Collaboration Layout Design for an Electronic System With Multi-Agent Method

Shintaro Hayashi, Yoshiharu Iwata, Ryohei Satoh, Kozo Fujimoto
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 679-685, July 8–12, 2007
Paper No: IPACK2007-33982
DOI: https://doi.org/10.1115/IPACK2007-33982
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Topics: Circuits, Collaboration, Design, Electronic systems, Electronics, Optimization, Boundary-value problems, Circuit design, Density, Design methodology
Proceedings Papers

Circuit-Thermal Collaboration Design Method for Outline Design Stage of Mobile Terminal

Yoshiharu Iwata, Shintaro Hayashi, Ryohei Satoh, Kozo Fujimoto
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 225-231, July 17–22, 2005
Paper No: IPACK2005-73157
DOI: https://doi.org/10.1115/IPACK2005-73157
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Topics: Circuits, Collaboration, Design, Design methodology
Proceedings Papers

Tackling the Drop Impact Reliability of Electronic Packaging

E. H. Wong, C. T. Lim, J. E. Field, V. B. C. Tan, V. P. W. Shim, K. M. Lim, S. K. W. Seah
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 757-763, July 6–11, 2003
Paper No: IPACK2003-35101
DOI: https://doi.org/10.1115/IPACK2003-35101
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Topics: Alloys, Collaboration, Design, Electronic packaging, Failure, Impact strength, Impact testing, Lead-free solders, Microelectronic devices, Physics