1-20 of 2108
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation

Chongyang Cai, Jiefeng Xu, Yangyang Lai, Junbo Yang, Huayan Wang, Suresh Ramalingam, Gamal Refai-Ahmed, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 25–27, 2022
Paper No: IPACK2022-97338
DOI: https://doi.org/10.1115/IPACK2022-97338
View Paper
PDF
Proceedings Papers

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A003, October 25–27, 2022
Paper No: IPACK2022-94505
DOI: https://doi.org/10.1115/IPACK2022-94505
View Paper
PDF
Topics: Anisotropy, Crystals, Electron backscatter diffraction, Shear (Mechanics), Solder joints
Proceedings Papers

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Golam Rakib Mazumder, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A002, October 25–27, 2022
Paper No: IPACK2022-93878
DOI: https://doi.org/10.1115/IPACK2022-93878
View Paper
PDF
Topics: Creep, Damage, Lead-free solders, Solders
Proceedings Papers

Machine Learning and Simulation Based Temperature Prediction on High-Performance Processors

Carlton Knox, Zihao Yuan, Ayse K. Coskun
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 25–27, 2022
Paper No: IPACK2022-96751
DOI: https://doi.org/10.1115/IPACK2022-96751
View Paper
PDF
Topics: Machine learning, Simulation, Temperature
Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Paper No: IPACK2022-97452
DOI: https://doi.org/10.1115/IPACK2022-97452
View Paper
PDF
Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods

David Leslie, Abhijit Dasgupta, Andrei Damian
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 25–27, 2022
Paper No: IPACK2022-97363
DOI: https://doi.org/10.1115/IPACK2022-97363
View Paper
PDF
Topics: Creep, Silver
Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Paper No: IPACK2022-97429
DOI: https://doi.org/10.1115/IPACK2022-97429
View Paper
PDF
Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

Compact and Highly Thermal-Hydraulic Efficient Air-Cooled Closed Loop Thermosyphon Cooling System for High Intense Heat Load Dissipation of Future Microprocessors

Enzo M. Minazzo, Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, L. Winston Zhang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 25–27, 2022
Paper No: IPACK2022-97364
DOI: https://doi.org/10.1115/IPACK2022-97364
View Paper
PDF
Topics: Cooling systems, Energy dissipation, Heat, Stress
Proceedings Papers

A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)

Abdul Basit Mirza, Xiaoqiang Xu, Asif Imran Emon, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A008, October 25–27, 2022
Paper No: IPACK2022-97886
DOI: https://doi.org/10.1115/IPACK2022-97886
View Paper
PDF
Topics: Design, Heat sinks, Optimization
Proceedings Papers

Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model

Utsav Gupta, Andras Vass-Varnai
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A007, October 25–27, 2022
Paper No: IPACK2022-97669
DOI: https://doi.org/10.1115/IPACK2022-97669
View Paper
PDF
Topics: Control systems, Design, Electric vehicles, Power converters, Automobiles, Batteries, Electronic components, Energy management, Modeling, Motors
Proceedings Papers

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

Pradeep Lall, Ved Soni
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 25–27, 2022
Paper No: IPACK2022-97451
DOI: https://doi.org/10.1115/IPACK2022-97451
View Paper
PDF
Topics: Batteries, Biomedical equipment, Cycles, Electronics, Errors, Flexible electronics, Industrial research, Model validation, Modeling, Service life (Equipment)
Proceedings Papers

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 25–27, 2022
Paper No: IPACK2022-97450
DOI: https://doi.org/10.1115/IPACK2022-97450
View Paper
PDF
Topics: Circuits, Electronics, Printing
Proceedings Papers

Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling

Filippo Cataldo, Raffaele Luca Amalfi
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 25–27, 2022
Paper No: IPACK2022-97729
DOI: https://doi.org/10.1115/IPACK2022-97729
View Paper
PDF
Topics: Computer cooling, Cooling, Cooling systems
Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Paper No: IPACK2022-97434
DOI: https://doi.org/10.1115/IPACK2022-97434
View Paper
PDF
Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Paper No: IPACK2022-97440
DOI: https://doi.org/10.1115/IPACK2022-97440
View Paper
PDF
Topics: Copper, Delamination, Displacement, Fracture (Materials), High temperature, Stress
Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Paper No: IPACK2022-97438
DOI: https://doi.org/10.1115/IPACK2022-97438
View Paper
PDF
Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry
Proceedings Papers

Comparative Analysis of Direct and Indirect Cooling of Wide-Bandgap Power Modules and Performance Enhancement of Jet Impingement-Based Direct Substrate Cooling

Himel Barua, Emre Gurpinar, Lingxiao Xue, Burak Ozpineci
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A002, October 25–27, 2022
Paper No: IPACK2022-97172
DOI: https://doi.org/10.1115/IPACK2022-97172
View Paper
PDF
Topics: Cooling, Energy gap
Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Paper No: IPACK2022-96635
DOI: https://doi.org/10.1115/IPACK2022-96635
View Paper
PDF
Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids
Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022
Paper No: IPACK2022-97437
DOI: https://doi.org/10.1115/IPACK2022-97437
View Paper
PDF
Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models
Proceedings Papers

Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level

Himanshu Modi, Pardeep Shahi, Akiilessh Sivakumar, Satyam Saini, Pratik Bansode, Vibin Shalom, Amrutha Valli Rachakonda, Gautam Gupta, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 25–27, 2022
Paper No: IPACK2022-97443
DOI: https://doi.org/10.1115/IPACK2022-97443
View Paper
PDF
Topics: Computational fluid dynamics, Cooling, Transient analysis, Transients (Dynamics)