Rapid temperature transients sustained during operation of high voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase Change Materials (PCMs) can be useful as a buffer against these intermittent temperature spikes when integrated into electronic packages. However, their integration poses challenges of both physical and electrical interactions within the package, particularly in high voltage systems. The present study aims to evaluate electrical and thermal properties of nano-enhanced PCMs to inform integration in high voltage systems. The nanocomposites are obtained by seeding 0.0006–0.12 wt% of Gold, Graphene Oxide, and Iron Oxide particles to Sorbitol. Improvements in thermal properties including latent heat as high as 15% are observed; however, this comes at the expense of dielectric strength of the PCM.

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