This study illustrates test results and comparative literature data on the influence of isothermal aging and thermal cycling associated with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ball grid array (BGA) solder joints on three board finishes (ImAg, ENIG, ENEPIG). The resulting degradation shows that the characteristic lifetimes for both SAC105 and SAC305 decrease in the order ENIG > ENEPIG > ImAg. SAC305, with a higher relative fraction of Ag3Sn IMC within the solder, performs better than SAC105. SEM and EDX analysis shows continuous growth of Cu-Sn intermetallic compounds (IMC) on SAC/ImAg systems and Cu-Ni-Sn IMC on SAC/ENIG/ENEPIG systems at board side solder joints, which eventually cause fatigue failures.
- Electronic and Photonic Packaging Division
Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling
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Shen, C, Hai, Z, Zhao, C, Zhang, J, Bozack, MJ, Suhling, JC, & Evans, JL. "Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales. San Francisco, California, USA. July 6–9, 2015. V002T02A033. ASME. https://doi.org/10.1115/IPACK2015-48009
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