Three-dimensional integration (3D IC) is a new technology that shows great potential for high performance and energy efficiency. However past work has shown that 3D ICs suffer from serious thermal issues, and advanced cooling solutions such as micro-fluidic cooling are necessary to realize the true potential of these systems. The interactions between thermal, electrical and physical aspects of a 3D design with micro-fluidic cooling are substantial, and a comprehensive co-design approach to address them simultaneously is a must. Such co-design techniques are required throughout the design process, including during architectural design space exploration (DSE) in order to ensure that optimal design choices are not overlooked. In this paper we propose a DSE framework for 3D CPUs with micro-fluidic cooling that applies electro-thermal optimization techniques to the circuit layout and the heatsink design. By considering such physical optimization techniques we provide a more accurate view of a 3D architecture’s thermal and timing feasibility, as well as its performance and energy efficiency. Using our proposed thermo-electrical-physical co-design DSE framework we are able to improve performance by 1.54x and energy efficiency by 1.26x.

This content is only available via PDF.
You do not currently have access to this content.