Fundamental study of deformation and fatigue fracture behavior of solder alloys under complex load conditions is a key to enabling implementation of sophisticated 3-D time-dependent nonlinear FEM stress and strain analyses and life assessment for electronic packages and assemblies. In this study, the rate-dependent deformation and fatigue fracture behavior of Sn3.8Ag0.7Cu Pb-free alloy and Sn-Pb eutectic alloy was investigated with thin-walled specimens using a bi-axial servo-controlled tension-torsion material testing system, with solder alloys subjected to a variety of complex load conditions: pure shearing at strain rates between 6.7×10−7 /sec to 1.3×10−1 /sec, creep at temperatures ranging from room temperature up to 125 °C, and cyclic loading with frequency of 0.001Hz to 3Hz. Bi-axial stress conditions were imposed for shearing tests to investigate effects of multi-axial stresses on deformation behavior. The effects of frequency and temperature on cyclic deformation and fatigue facture were investigated for lead-free Sn3.8Ag0.7Cu and Sn-Pb eutectic solder. Fractography of fatigue tested samples were also conducted to determine possible fatigue failure mechanisms.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Deformation and Fatigue Fracture of Pb-Free Solder Alloys Under Complicated Load Conditions
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Liang, J, Dariavach, N, Callahan, P, Shangguan, D, & Li, X. "Deformation and Fatigue Fracture of Pb-Free Solder Alloys Under Complicated Load Conditions." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 927-938. ASME. https://doi.org/10.1115/IPACK2005-73257
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