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Keywords: Thermal management
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Proceedings Papers
Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A060, October 30–November 3, 2022
Paper No: IMECE2022-96606
... to very high values, resulting in both physical and chemical changes in the cable, and in some cases, local burnings. A literature survey revealed that there are only a few studies that dealt with the thermal management of fiber optical cables. In this study, we analyze the thermal behavior of fiber...
Proceedings Papers
Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A014, October 30–November 3, 2022
Paper No: IMECE2022-94225
... by influencing heat transfer in designated areas. A robust and economical containment method for PCM is still required for munition applications. munitions phase change materials thermal management safety Proceedings of the ASME 2022 International Mechanical Engineering Congress and Exposition...
Proceedings Papers
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A038, November 1–5, 2021
Paper No: IMECE2021-69055
... prismatic batteries is performed using a multidomain modeling framework. The well-known Newman, Tiedemann, Gu, and Kim (NTGK) model is used for modelling. A thermal management system based on liquid cooling via cold plates utilizing glycol aqueous solution (GAS) is proposed. Cooling simulations...
Proceedings Papers
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 283-290, November 11–16, 2001
Paper No: IMECE2001/HTD-24405
... temperature) lower than 100°C. capillary pumped loop heat spreader phase change thermal management porous sheet CPU IGBT Proceedings of 2001 ASME International Mechanical Engineering Congress and Exposition November 11-16, 2001, New York, NY HTD-Vol. 369-7 IMECE2001 /HTD-24405 CAPILLARY PUMPED...
Proceedings Papers
Proc. ASME. IMECE2001, Process Industries, 191-202, November 11–16, 2001
Paper No: IMECE2001/PID-25622
... on the surfaces of the dried product and of the condenser. This pressure drop environment, however noise and vibrations, produced by the vapor is a main moving force of the drying process [4,5], compressing system, can affect the benefits of the compact freeze- dryers; 2. THERMAL MANAGEMENT OP FREEZE-DRYING...
Proceedings Papers
Proc. ASME. IMECE2020, Volume 8: Energy, V008T08A046, November 16–19, 2020
Paper No: IMECE2020-24153
...THERMAL MANAGEMENT OF A REVERSIBLE SOLID OXIDE SYSTEM FOR LONG-TERM RENEWABLE ENERGY STORAGE Pegah Mottaghizadeh 1, Faryar Jabbari3, Jack Brouwer4 Department of Mechanical and Aerospace Engineering, University of California, Irvine Irvine, CA, USA Mahshid Fardadi2 Department of Mechanical...
Proceedings Papers
Proc. ASME. IMECE2019, Volume 8: Heat Transfer and Thermal Engineering, V008T09A033, November 11–14, 2019
Paper No: IMECE2019-10470
...Abstract Abstract Carbon Dioxide (SCO 2 ) can revolutionize the thermal management landscape due to a dramatic increase in enthalpy and a specific heat near supercritical state, particularly along the pseudocritical line, which correspond to much lower temperatures and pressures than water...
Proceedings Papers
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1719-1724, November 9–15, 2012
Paper No: IMECE2012-87890
... stability, and remarkable chemical inertness. These 2D nanostructures have been used to create composite fluids for diverse thermal management applications, such as microelectronics, high voltage power transmission systems, automobiles, solar cells, biopharmaceuticals, medical therapy/diagnosis, and nuclear...
Proceedings Papers
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 253-261, November 12–18, 2010
Paper No: IMECE2010-40527
... environment packaging (low temperature, high vacuum). The objective of this modeling work is to: explain the role of underfill in harsh environment cryogenic packages, explore the role of polymers and nanocomposites in filling this role, and anticipate the role of manufacturing defects on thermal management...
Proceedings Papers
Proc. ASME. IMECE2002, Advanced Energy Systems, 573-582, November 17–22, 2002
Paper No: IMECE2002-33033
... at a smaller thickness, whereas a thicker plate provided a more uniform distribution of heat transfer coefficient. Compared to Mil-7808 and FC-77, ammonia provided much smaller solid-fluid interface temperature and higher heat transfer coefficient. Jet Impingement Ammonia Thermal Management...
Proceedings Papers
Proc. ASME. IMECE2002, Heat Transfer, Volume 6, 241-245, November 17–22, 2002
Paper No: IMECE2002-33893
... 23 05 2008 UL requires that cooking appliances meet temperature restriction requirements on the outside surfaces for consumer safety. Application of Computational Fluid Dynamics has revealed the relative importance of conduction, convection and radiation in the thermal management...
Proceedings Papers
Proc. ASME. IMECE2003, Advanced Energy Systems, 437-446, November 15–21, 2003
Paper No: IMECE2003-42527
..., and tremendous potential benefit lies in the optimization of the cooling process. This paper describes a study performed on data center thermal management systems using the thermodynamic concept of exergy. Specifically, an exergy analysis has been performed on sample data centers in an attempt to identify local...
Proceedings Papers
Proc. ASME. IMECE2003, Heat Transfer, Volume 1, 357-360, November 15–21, 2003
Paper No: IMECE2003-43361
.... Cooking Range Computational Fluid Dynamics Thermal management Range door design Proceedings of IMECE 03 2003 ASME International Mechanical Engineering Congress and RD&D Exposition November 16-21, 2003 Washington, DC * The auth range door through natural convection has been optimized with the aid...
Proceedings Papers
Proc. ASME. IMECE2004, Heat Transfer, Volume 1, 61-67, November 13–19, 2004
Paper No: IMECE2004-61384
... and miniaturization of electronic equipment has caused a dramatic increase in the amount of heat dissipated within data centers housing compute, network, and storage systems. The efficient thermal management of these systems is complicated by the intricate interdependence among the various components of the thermal...
Proceedings Papers
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 425-431, November 5–11, 2005
Paper No: IMECE2005-79732
... device temperature needs to be around 100 C. One of the primary obstacles to the thermal management of devices operating at such high powers is the thermal resistance between the device and the heat spreader or heat sink that it is attached to. Typically the in situ thermal conductivity of interface...
Proceedings Papers
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 467-472, November 5–11, 2005
Paper No: IMECE2005-79771
...Proceedings of IMECE2005 2005 ASME International Mechanical Engineering Congress and Exposition KEY WORDS: Thermal Management, Carbon Nanotubes, Thermal interface material (TIM), Analytical modeling. NOMENCLATURE x,y,z Rectangular Coordinates, m N Number of layers Ts Temperature in sth layer, s= 1...
Proceedings Papers
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 93-104, November 5–10, 2006
Paper No: IMECE2006-13743
... or cross flow position, it can provide similar enhancement. synthetic jets electronics cooling thermal management impingement jet design Mittal R. and Rampunggoon P. , 2002 , “ On virtual aeroshaping effect of synthetic jets ,” Phys. Fluids (Brief Communication) , 14 ( 4...
Proceedings Papers
Proc. ASME. IMECE2006, Fluids Engineering, 81-87, November 5–10, 2006
Paper No: IMECE2006-14283
... ABSTRACT Thermal management has become a key point in the development of contemporary electronics systems. It is evident that heat fluxes are currently approaching the limits of conventional forced air cooling, and that liquid technologies are now under consideration. The objective of this paper...