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Proceedings Papers

Determination of Interfacial Fracture Toughness in High Temperature Composites

V. Bechel, N. R. Sottos
Proc. ASME. IMECE96, Aerospace and Materials, 155-165, November 17–22, 1996
Paper No: IMECE1996-0475
https://doi.org/10.1115/IMECE1996-0475
View Paper titled, Determination of Interfacial Fracture Toughness in High Temperature Composites
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Topics: Composite materials, Fracture toughness, High temperature, Fibers, Temperature, Epoxy adhesives, Epoxy resins, Polyester fabrics, Stress, Shear (Mechanics)
Proceedings Papers

Variation of Young’s Modulus and Hardness in Human Lumbar Vertebrae Measured by Nanoindentation

Marcel Roy, Jae-Young Rho, Ting Y. Tsui, George M. Pharr
Proc. ASME. IMECE96, Advances in Bioengineering, 385-386, November 17–22, 1996
Paper No: IMECE1996-1276
https://doi.org/10.1115/IMECE1996-1276
View Paper titled, Variation of Young’s Modulus and Hardness in Human Lumbar Vertebrae Measured by Nanoindentation
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Topics: Lumbar spine, Nanoindentation, Young's modulus, Bone, Mechanical properties, Elastic moduli
Proceedings Papers

Tension-Tension Fatigue of Copper Thin Films

David T. Read
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 175-180, November 17–22, 1996
Paper No: IMECE1996-0732
https://doi.org/10.1115/IMECE1996-0732
View Paper titled, Tension-Tension Fatigue of Copper Thin Films
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Topics: Copper, Fatigue, Tension, Thin films, Stress, Cycles, Electrons, Fatigue testing, Feedback, Piezoelectric actuators
Proceedings Papers

Measurement of Mechanical Properties of Electroplated Nickel-Iron Alloys

Charles C. Chung, Mark G. Allen
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 453-457, November 17–22, 1996
Paper No: IMECE1996-1389
https://doi.org/10.1115/IMECE1996-1389
View Paper titled, Measurement of Mechanical Properties of Electroplated Nickel-Iron Alloys
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Topics: Alloys, Iron, Mechanical properties, Nickel, Shear modulus, Microfabrication, Young's modulus
Proceedings Papers

Two-Dimensional Stress Analysis of Single-Lap Joints of Dissimilar Adherends Subjected to External Bending Moments

Toshiyuki Sawa, Katsuyuki Nakano, Hiroshi To Ratani
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 9-15, November 17–22, 1996
Paper No: IMECE1996-0854
https://doi.org/10.1115/IMECE1996-0854
View Paper titled, Two-Dimensional Stress Analysis of Single-Lap Joints of Dissimilar Adherends Subjected to External Bending Moments
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Topics: Adhesive joints, Adhesives, Contact mechanics, Elasticity, Strain measurement, Stress, Stress analysis (Engineering), Stress concentration, Stress singularity, Strips
Proceedings Papers

Three-Dimensionai Finite Element Analysis of Stress Response in Adhesive Butt Joints Subjected to Impact Tensile Loads

Toshiyuki Sawa, Hirohisa Okuno, Izumi Higuchi
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 1-7, November 17–22, 1996
Paper No: IMECE1996-0853
https://doi.org/10.1115/IMECE1996-0853
View Paper titled, Three-Dimensionai Finite Element Analysis of Stress Response in Adhesive Butt Joints Subjected to Impact Tensile Loads
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Topics: Adhesives, Finite element analysis, Stress, Shapes, Weight (Mass), Young's modulus, Finite element methods, Wave propagation, Geometry, Strain gages
Proceedings Papers

Uncertainty Quantification in Material Properties of Additively Manufactured Materials for Application in Topology Optimization

Zahra Kazemi, Craig A. Steeves
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A009, October 30–November 3, 2022
Paper No: IMECE2022-95195
https://doi.org/10.1115/IMECE2022-95195
View Paper titled, Uncertainty Quantification in Material Properties of Additively Manufactured Materials for Application in Topology Optimization
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Topics: Additive manufacturing, Machine learning, Materials properties, Topology optimization, Uncertainty quantification, Elastic moduli, Chaos, Young's modulus, Algorithms, Design
Proceedings Papers

Optical Full-Field Strain Visualization on Bone

Nahel Haji, Ryan Fernandez, LaRance Haji, Badih Jawad, Hamid Vejdani, Vernon Fernandez
Proc. ASME. IMECE2022, Volume 4: Biomedical and Biotechnology; Design, Systems, and Complexity, V004T05A044, October 30–November 3, 2022
Paper No: IMECE2022-96154
https://doi.org/10.1115/IMECE2022-96154
View Paper titled, Optical Full-Field Strain Visualization on Bone
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Topics: Bone, Visualization, Finite element analysis, Deflection, Stress, Bone fractures, Bone mechanics, Fracture (Materials), Fracture (Process), Gages
Proceedings Papers

Experimental and Statistical Optimization of Carbon-Fiber Reinforced Nylon Composite Based 3D Printed Cellular Structures

Ahmad Hisham, Shafahat Ali, Said Abdallah, Abdallah Nassir Abdo Mohammed, Rahmat Agung Susantyoko, Salman Pervaiz
Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A021, October 30–November 3, 2022
Paper No: IMECE2022-95727
https://doi.org/10.1115/IMECE2022-95727
View Paper titled, Experimental and Statistical Optimization of Carbon-Fiber Reinforced Nylon Composite Based 3D Printed Cellular Structures
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Topics: Additive manufacturing, Carbon fibers, Composite materials, Nylon fabrics, Optimization, Carbon, Geometry, Advanced materials, Fibers, Diamonds
Proceedings Papers

Development of the Ultrasonic System Integration With 3D Polymer Printing

Jonathan England, Ethan Darnell, Janak Bhakta, Maria D’Orazio, Mariya Chukovenkova, Andrei Zagrai
Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A052, October 30–November 3, 2022
Paper No: IMECE2022-96028
https://doi.org/10.1115/IMECE2022-96028
View Paper titled, Development of the Ultrasonic System Integration With 3D Polymer Printing
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Topics: Polymers, Printing, Ultrasonic transducers, Temperature, Additive manufacturing, Finite element analysis, Materials properties, Nondestructive evaluation, Steel, Young's modulus
Proceedings Papers

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

S. Shakya, S. M. Heinrich, J. Liang, P. S. Lee
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 55-63, November 16–21, 1997
Paper No: IMECE1997-0814
https://doi.org/10.1115/IMECE1997-0814
View Paper titled, Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly
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Topics: Ball-Grid-Array packaging, Ceramics, Computer simulation, Die cutting, Disks, Displacement, Finite element analysis, Finite element methods, Flip-chip packages, Geometry
Proceedings Papers

A Microstructure for the In Situ Determination of Residual Strain

Chi Shiang Pan, Wensyang Hsu
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 105-111, November 16–21, 1997
Paper No: IMECE1997-0947
https://doi.org/10.1115/IMECE1997-0947
View Paper titled, A Microstructure for the In Situ Determination of Residual Strain
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Topics: Annealing, Cantilever beams, Deflection, Displacement, Finite element analysis, Modeling, Polysilicon, Strain sensors, Young's modulus
Proceedings Papers

Design, Fabrication and Static Test of a Resonant Microaccelerometer

Si Young Kim, Jeung Sang Go, Young-Ho Cho
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 21-26, November 16–21, 1997
Paper No: IMECE1997-0933
https://doi.org/10.1115/IMECE1997-0933
View Paper titled, Design, Fabrication and Static Test of a Resonant Microaccelerometer
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Topics: Design, Manufacturing, Resonance, Accelerometers, Micromachining, Polysilicon, Stress, Annealing, Deflection, Mechanical structures
Proceedings Papers

Evaluation of Elastic Properties of a Functionally Graded Composite Using an Elastic-Impact Technique

Prabhakar R. Marur, Hareesh V. Tippur
Proc. ASME. IMECE97, Noise Control and Acoustics, 227-234, November 16–21, 1997
Paper No: IMECE1997-1048
https://doi.org/10.1115/IMECE1997-1048
View Paper titled, Evaluation of Elastic Properties of a Functionally Graded Composite Using an Elastic-Impact Technique
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Topics: Composite materials, Elasticity, Functionally graded materials, Echoes, Epoxy adhesives, Epoxy resins, Glass, Impact testing, Particulate matter, Poisson ratio
Proceedings Papers

Nondestructive Elastic Property Characterization of IC Encapsulants

Sridhar Canumalla, Michael G. Oravecz
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 25-32, November 16–21, 1997
Paper No: IMECE1997-0496
https://doi.org/10.1115/IMECE1997-0496
View Paper titled, Nondestructive Elastic Property Characterization of IC Encapsulants
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Topics: Delamination, Elasticity, Fillers (Materials), Flip-chip packages, Integrated circuit packaging, Molding, Process control, Reliability, Resins, Young's modulus
Proceedings Papers

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

Hung-Jue Sue, P. Mac Puckett, Yee Y. Wang
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 163-168, November 16–21, 1997
Paper No: IMECE1997-0512
https://doi.org/10.1115/IMECE1997-0512
View Paper titled, Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles
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Topics: Epoxy adhesives, Particulate matter, Shells, Rubber, Adhesives, Elastic moduli, Fracture toughness, Glass transition, Materials properties, Shear (Mechanics)
Proceedings Papers

Study on Robust Fail-Safe Structural Design Method

Tomoyuki Hiroyasu, Maho Shoji, Hiroshi Yamakawa
Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 221-228, November 16–21, 1997
Paper No: IMECE1997-0537
https://doi.org/10.1115/IMECE1997-0537
View Paper titled, Study on Robust Fail-Safe Structural Design Method
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Topics: Structural design, Flow (Dynamics), Design, Automobiles, Hull, Robustness, Ships, Structures, Topology, Young's modulus
Proceedings Papers

Electrostatic Mechanical Testing of Polysilicon

William N. Sharpe, Jr., Kevin Turner, Richard L. Edwards
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 385-388, November 15–20, 1998
Paper No: IMECE1998-1273
https://doi.org/10.1115/IMECE1998-1273
View Paper titled, Electrostatic Mechanical Testing of Polysilicon
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Topics: Mechanical testing, Polysilicon, Brittleness, Cross section (Physics), Displacement, Interferometry, Lasers, Microelectromechanical systems, Tensile strength, Testing
Proceedings Papers

Analysis on Multi-Layered, Corrugated Diaphragm With Residual Stress

Hai Yan, Kuok Chun Lou, Byungchai Lee, Eun Sok Kim
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 373-378, November 15–20, 1998
Paper No: IMECE1998-1271
https://doi.org/10.1115/IMECE1998-1271
View Paper titled, Analysis on Multi-Layered, Corrugated Diaphragm With Residual Stress
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Topics: Diaphragms (Mechanical devices), Diaphragms (Structural), Stress, Deflection, Pressure, Residual stresses, Stress concentration, Anisotropy, Design, Finite difference methods
Proceedings Papers

In-Situ Test Structures for Metrological and Mechanical Characterization of MEMS

Raj K. Gupta
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 141-143, November 15–20, 1998
Paper No: IMECE1998-1149
https://doi.org/10.1115/IMECE1998-1149
View Paper titled, In-Situ Test Structures for Metrological and Mechanical Characterization of MEMS
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Topics: Microelectromechanical systems, Errors, Geometry, Mechanical properties, Stiffness, Calibration, Deflection, Electrical measurement, Semiconductor wafers, Stress