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Proceedings Papers

Models of Fracture-Matrix Interactions During Multiphase Heat and Mass Flow in Unsaturated Fractured Porous Media

Clifford K. Ho

Proc. ASME. IMECE97, Fluids Engineering, 401-412, November 16–21, 1997

Paper No: IMECE1997-0798

DOI: https://doi.org/10.1115/IMECE1997-0798

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Topics: Flow (Dynamics), Fracture (Materials), Fracture (Process), Heat, Porous materials, Permeability, Electrical conductance, Engineering simulation, Numerical analysis, Simulation

Proceedings Papers

Heat Transfer in a Matrix With Embedded Particles

Brian Vick, E. P. Scott

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 193-198, November 15–20, 1998

Paper No: IMECE1998-0705

DOI: https://doi.org/10.1115/IMECE1998-0705

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Topics: Heat transfer, Particulate matter, Electrical conductance, Heat, Heat flux, Constitutive equations, Diffusion (Physics), Electrons, Finite difference methods, Heat conduction

Proceedings Papers

Three-Dimensional Thermal Model of Resistance Spot Welding in Aluminum

A. A. S. Arefin Kabir, Jamil A. Khan, Kirk Broach

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 371-380, November 14–19, 1999

Paper No: IMECE1999-1094

DOI: https://doi.org/10.1115/IMECE1999-1094

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Topics: Aluminum, Welding, Electrodes, Contact resistance, Convection, Electrical conductance, Computer simulation, Dynamics (Mechanics), Fluids, Geometry

Proceedings Papers

Infrared Vision Using an Uncooled Thermo-Opto-Mechanical Camera: Design, Microfabrication, and Performance

M. Mao, T. Perazzo, O. Kwon, Y. Zhao, A. Majumdar, J. Varesi, P. Norton

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 309-316, November 14–19, 1999

Paper No: IMECE1999-0285

DOI: https://doi.org/10.1115/IMECE1999-0285

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Topics: Design, Microfabrication, Cantilevers, Temperature, Absorption, Cantilever beams, Electrical conductance, Thermomechanics, Adhesion, Cavities

Proceedings Papers

Characteristics of Continuous CVD of Silicon With a Moving Susceptor

Hoseon Yoo, Yogesh Jaluria

Proc. ASME. IMECE2001, Heat Transfer: Volume 6 — Heat Transfer in Materials Processing, 133-141, November 11–16, 2001

Paper No: IMECE2001/HTD-24344

DOI: https://doi.org/10.1115/IMECE2001/HTD-24344

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Topics: Chemical vapor deposition, Silicon, Accounting, Computer simulation, Design, Electrical conductance, Energy budget (Physics), Heat transfer, Heating, Thermal diffusion

Proceedings Papers

Prediction of Thermal Contact Conductance by Surface Deformation Analysis

Vishal Singhal, Suresh V. Garimella

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 43-50, November 11–16, 2001

Paper No: IMECE2001/HTD-24376

DOI: https://doi.org/10.1115/IMECE2001/HTD-24376

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Topics: Contact resistance, Electrical conductance, Surface deformation

Proceedings Papers

Small Diameter Effects on Internal Flow Boiling

Gail E. Kendall, Peter Griffith, Arthur E. Bergles, John H. Lienhard, V

Proc. ASME. IMECE2001, Heat Transfer: Volume 3 — Fluid-Physics and Heat Transfer for Macro- and Micro-Scale Gas-Liquid and Phase-Change Flows, 153-169, November 11–16, 2001

Paper No: IMECE2001/HTD-24211

DOI: https://doi.org/10.1115/IMECE2001/HTD-24211

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Topics: Boiling, Computation, Critical heat flux, Design, Electrical conductance, Electronics, Flow (Dynamics), Flow instability, Heat transfer, HVAC equipment

Proceedings Papers

Microfluidic Level Sensors

M. Sesterhenn, T. Strobelt, H. Ashauer, G. Raffa, H. Sandmaier, M. Schmitt

Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 397-403, November 5–10, 2000

Paper No: IMECE2000-1122

DOI: https://doi.org/10.1115/IMECE2000-1122

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Topics: Microfluidics, Sensors, Signals, Electrolytes, Resolution (Optics), Bubbles, Capacitors, Design, Electrical conductance, Electronics

Proceedings Papers

Experimental Investigation of Contact Resistance Across Pressed Lead and Aluminum Contact in Vacuum

Xiao Ma, Jamil A. Khan, Curtis A. Rhodes, Allen Smith, L. Larry Hamm

Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 155-162, November 5–10, 2000

Paper No: IMECE2000-1423

DOI: https://doi.org/10.1115/IMECE2000-1423

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Topics: Aluminum, Contact resistance, Vacuum, Temperature, Pressure, Surface roughness, Cladding systems (Building), Cooling, Design, Electrical conductance

Proceedings Papers

Measurement and Prediction of the Contact Conductance Across Epoxied Copper Contacts at Cryogenic Temperatures

Lisa De Bellis, Patrick E. Phelan

Proc. ASME. IMECE2000, Heat Transfer: Volume 1, 221-227, November 5–10, 2000

Paper No: IMECE2000-1386

DOI: https://doi.org/10.1115/IMECE2000-1386

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Topics: Copper, Electrical conductance, Temperature, Epoxy adhesives, Epoxy resins, Acoustics, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Interfacial thermal resistance

Proceedings Papers

Exploration of Variable Conductance Effects During Input and Extraction of Heat From Phase Change Thermal Storage

Zachary M. Theroff, Dre Helmns, Van P. Carey

Proc. ASME. IMECE2018, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A033, November 9–15, 2018

Paper No: IMECE2018-88078

DOI: https://doi.org/10.1115/IMECE2018-88078

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Topics: Electrical conductance, Heat, Thermal energy storage, Thermal conductivity, Fluids, Computation, Dimensions, Resistors, Storage, Testing

Proceedings Papers

Lightning Strike Protection and EMI Shielding of Fiber Reinforced Composite Using Gold and Silver Nanofilms

Praveen K. Bollavaram, Muhammad M. Rahman, R. Asmatulu

Proc. ASME. IMECE2018, Volume 1: Advances in Aerospace Technology, V001T03A028, November 9–15, 2018

Paper No: IMECE2018-88639

DOI: https://doi.org/10.1115/IMECE2018-88639

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Topics: Fiber reinforced composites, Lightning, Silver, Composite materials, Damage, Carbon fibers, Aircraft, Sandwich structures, Currents, Electrical conductance

Proceedings Papers

Performance Comparison and Parametric Analysis of sCO2 Power Cycles Configurations

Ali S. Alsagri, Andrew Chiasson, Ahmad Aljabr

Proc. ASME. IMECE2018, Volume 6B: Energy, V06BT08A007, November 9–15, 2018

Paper No: IMECE2018-86843

DOI: https://doi.org/10.1115/IMECE2018-86843

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Topics: Accuracy and precision, Brayton cycle, Compression, Computer software, Cycles, Design, Electrical conductance, Genetic algorithms, Heat exchangers, Optimization

Proceedings Papers

Heat Transfer Across Crystalline and Amorphous Silicon Surfaces in Contact With Water and the Effects of the Interfacial Liquid Structuring

Luis E. Paniagua-Guerra, C. Ulises Gonzalez-Valle, Bladimir Ramos-Alvarado

Proc. ASME. IMECE2018, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A046, November 9–15, 2018

Paper No: IMECE2018-86497

DOI: https://doi.org/10.1115/IMECE2018-86497

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Topics: Heat transfer, Silicon, Water, Particulate matter, Density, Electrical conductance, Engineering simulation, Mechanical admittance, Molecular dynamics, Nanoscale heat transfer

Proceedings Papers

Impact of Grain Boundaries on the Heat Conductivity of Mono-Layer Hexagonal Boron Nitride

Mohan S. R. Elapolu, Alireza Tabarraei

Proc. ASME. IMECE2017, Volume 8: Heat Transfer and Thermal Engineering, V008T10A011, November 3–9, 2017

Paper No: IMECE2017-71415

DOI: https://doi.org/10.1115/IMECE2017-71415

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Topics: Boron, Grain boundaries, Thermal conductivity, Electrical conductance, Temperature profiles, Density, Modeling, Molecular dynamics, Thermal properties

Proceedings Papers

Numerical Simulations of Thermal Transport in Random Porous Materials and Powder Systems Using the Smoothed Particle Hydrodynamics Method

Deepak Shah, Alexey N. Volkov

Proc. ASME. IMECE2017, Volume 2: Advanced Manufacturing, V002T02A019, November 3–9, 2017

Paper No: IMECE2017-72055

DOI: https://doi.org/10.1115/IMECE2017-72055

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Topics: Computer simulation, Hydrodynamics, Particulate matter, Porous materials, Thermal conductivity, Electrical conductance, Contact resistance, Density, Numerical analysis, Particle size

Proceedings Papers

Thermal Interface Conductance Between Aligned Polyethylene and Graphite

Wei Lv, Asegun Henry

Proc. ASME. IMECE2015, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A001, November 13–19, 2015

Paper No: IMECE2015-50492

DOI: https://doi.org/10.1115/IMECE2015-50492

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Topics: Electrical conductance, Graphite, Polymer fibers, Atomic interactions, Engineers, Molecular dynamics simulation, Polyethylene chains, Polymer composites, Thermal conductivity

Proceedings Papers

Effect of the Interface Mixing Layer on the Thermal Boundary Conductance of Metal-Organic Semiconductor Thin Film–Numerical Study by Lattice Boltzmann Method

Xinyu Wang, Paddy K. L. Chan

Proc. ASME. IMECE2014, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A005, November 14–20, 2014

Paper No: IMECE2014-37785

DOI: https://doi.org/10.1115/IMECE2014-37785

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Topics: Electrical conductance, Lattice Boltzmann methods, Metals, Semiconductors (Materials), Thin films, Bonding, Elastic constants, Simulation, Simulation results, Springs

Proceedings Papers

Measurement of Thermal Conduction Through Polymeric Nanowires With the Dual Cantilever Technique

Carlo Canetta, Arvind Narayanaswamy

Proc. ASME. IMECE2014, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A050, November 14–20, 2014

Paper No: IMECE2014-38233

DOI: https://doi.org/10.1115/IMECE2014-38233

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Topics: Cantilevers, Heat conduction, Nanowires, Electrical conductance, Thermal conductivity, Lasers, Microcantilevers, Resolution (Optics), Electrospinning, Flow (Dynamics)

Proceedings Papers

Design and Real Time Simulation of Artificial Intelligent Based MPP Tracker for Photo-Voltaic System

Shimi Sudha Letha, Tilak Thakur, Jagdish Kumar, Dnyaneshwar Karanjkar, Santanu Chatterji

Proc. ASME. IMECE2014, Volume 6B: Energy, V06BT07A037, November 14–20, 2014

Paper No: IMECE2014-37967

DOI: https://doi.org/10.1115/IMECE2014-37967

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Topics: Design, Photovoltaic power systems, Simulation, Algorithms, Artificial neural networks, Computer software, Control equipment, Electrical conductance, Engineering prototypes, Matlab

NARROW

Models of Fracture-Matrix Interactions During Multiphase Heat and Mass Flow in Unsaturated Fractured Porous Media

Heat Transfer in a Matrix With Embedded Particles

Three-Dimensional Thermal Model of Resistance Spot Welding in Aluminum

Infrared Vision Using an Uncooled Thermo-Opto-Mechanical Camera: Design, Microfabrication, and Performance

Characteristics of Continuous CVD of Silicon With a Moving Susceptor

Prediction of Thermal Contact Conductance by Surface Deformation Analysis

Small Diameter Effects on Internal Flow Boiling

Microfluidic Level Sensors

Experimental Investigation of Contact Resistance Across Pressed Lead and Aluminum Contact in Vacuum

Measurement and Prediction of the Contact Conductance Across Epoxied Copper Contacts at Cryogenic Temperatures

Exploration of Variable Conductance Effects During Input and Extraction of Heat From Phase Change Thermal Storage

Lightning Strike Protection and EMI Shielding of Fiber Reinforced Composite Using Gold and Silver Nanofilms

Performance Comparison and Parametric Analysis of sCO2 Power Cycles Configurations

Heat Transfer Across Crystalline and Amorphous Silicon Surfaces in Contact With Water and the Effects of the Interfacial Liquid Structuring

Impact of Grain Boundaries on the Heat Conductivity of Mono-Layer Hexagonal Boron Nitride

Numerical Simulations of Thermal Transport in Random Porous Materials and Powder Systems Using the Smoothed Particle Hydrodynamics Method

Thermal Interface Conductance Between Aligned Polyethylene and Graphite

Effect of the Interface Mixing Layer on the Thermal Boundary Conductance of Metal-Organic Semiconductor Thin Film–Numerical Study by Lattice Boltzmann Method

Measurement of Thermal Conduction Through Polymeric Nanowires With the Dual Cantilever Technique

Design and Real Time Simulation of Artificial Intelligent Based MPP Tracker for Photo-Voltaic System

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