Abstract
A three-dimensional simulation of moving boundaries in an inertia-free, incompressible flow is presented. A control volume approach with a fixed finite element mesh is used to predict the fluid front advancement. Predicted fluid front advancement and pressure variation in a flow domain similar to the mold used for microchip encapsulation are compared with the corresponding experimental results.
Volume Subject Area:
Recent Advances in Microchip Packaging
Copyright © 1998 by The American Society of Mechanical Engineers
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