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1-20 of 30
8th International Conference on Design and Design Education
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Proceedings Papers
J. M. Munoz-Guijosa, A. Di´az-Lantada, J. Echa´varri, J. L. Mun˜oz, E. Chaco´n, P. Lafont, V. Rodri´guez, D. Ferna´ndez, E. de la Guerra
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 683-695, August 28–31, 2011
Paper No: DETC2011-48078
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 589-598, August 28–31, 2011
Paper No: DETC2011-48168
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 697-703, August 28–31, 2011
Paper No: DETC2011-48242
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 793-804, August 28–31, 2011
Paper No: DETC2011-48378
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 599-606, August 28–31, 2011
Paper No: DETC2011-48310
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 705-716, August 28–31, 2011
Paper No: DETC2011-48258
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 607-614, August 28–31, 2011
Paper No: DETC2011-48357
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 805-813, August 28–31, 2011
Paper No: DETC2011-48446
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 615-623, August 28–31, 2011
Paper No: DETC2011-48724
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 717-727, August 28–31, 2011
Paper No: DETC2011-48298
Proceedings Papers
Keith Hurdelbrink, Bobby Doyle, David Collins, Nic N. Evans, Paul A. Hatch, Thomas Ingram, James W. Kucinskas, Zachary Moorhead-Rosenberg, Zahed Siddique
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 815-822, August 28–31, 2011
Paper No: DETC2011-48648
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 625-636, August 28–31, 2011
Paper No: DETC2011-47852
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 729-739, August 28–31, 2011
Paper No: DETC2011-48438
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 823-832, August 28–31, 2011
Paper No: DETC2011-47577
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 741-750, August 28–31, 2011
Paper No: DETC2011-48817
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 637-643, August 28–31, 2011
Paper No: DETC2011-48163
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 833-843, August 28–31, 2011
Paper No: DETC2011-47847
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 845-849, August 28–31, 2011
Paper No: DETC2011-48454
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 763-772, August 28–31, 2011
Paper No: DETC2011-48265
Proceedings Papers
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 655-660, August 28–31, 2011
Paper No: DETC2011-48571
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