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Proceedings Papers

Design, Fabrication and Testing of Cooling Systems for a Particle Accelerator

John D. Bernardin, Walter C. Barkley, Jack Gioia, Pilar Marroquin
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T09A008, July 9–12, 2017
Paper No: HT2017-4996
DOI: https://doi.org/10.1115/HT2017-4996
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Topics: Cooling systems, Design, Manufacturing, Particle accelerators, Testing, Water, Plumbing, Temperature, Computer simulation, Flow (Dynamics)
Proceedings Papers

3D Thermal Resistance Network Method for the Design of Highly Integrated Packages

Lauren Boteler, Andrew Smith
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A009, July 14–19, 2013
Paper No: HT2013-17575
DOI: https://doi.org/10.1115/HT2013-17575
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Topics: Design, Thermal resistance, Packaging, Resistors, Temperature, Cooling, Dimensions, Electronics, Computer simulation, Energy dissipation
Proceedings Papers

Sensitivity of Thermal Transport and Phase-Change in Thin Porous Layers to the Distribution of the Solid Matrix

Vinaykumar Konduru, Ezequiel Medici, Jeffrey S. Allen
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T01A037, July 14–19, 2013
Paper No: HT2013-17476
DOI: https://doi.org/10.1115/HT2013-17476
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Topics: Flow (Dynamics), Fuel cells, Heat transfer, Mass transfer, Multiphase flow, Network models, Porous materials, Proton exchange membrane fuel cells, Proton exchange membranes, Water
Proceedings Papers

Microstructure-Dependent Heat Transfer Modeling of Carbon Nanotube Arrays for Thermal Interface Applications

Sridhar Sadasivam, Stephen L. Hodson, Timothy S. Fisher
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A045, July 14–19, 2013
Paper No: HT2013-17337
DOI: https://doi.org/10.1115/HT2013-17337
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Topics: Carbon nanotubes, Heat transfer, Modeling, Simulation, Stress, Thermomechanics, Buckling, Chaos, Electrical conductivity, Network models
Proceedings Papers

Effect of Nanoscale Structure on Thermal Contact Resistance of Carbon Nanotubes

Yutaka Yamada, Takashi Nishiyama, Tatsuya Ikuta, Koji Takahashi
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 173-177, July 8–12, 2012
Paper No: HT2012-58203
DOI: https://doi.org/10.1115/HT2012-58203
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Topics: Carbon nanotubes, Contact resistance, Nanoscale phenomena, Nanotubes, Thermal conductivity, Multi-walled carbon nanotubes, Network models, Reliability, Thermal management
Proceedings Papers

A Simple Model for Transient Thermal Behavior of Integrated Circuit Package Systems for Use in Determining a Thermal Design Power

Julia C. Huang, Niyati Pise, Deepak Ganapathy, Shushanth Prabhu, Ethan J. Warner
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 839-846, July 19–23, 2009
Paper No: HT2009-88229
DOI: https://doi.org/10.1115/HT2009-88229
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Topics: Design, Integrated circuits, Transients (Dynamics), Capacitance, Cooling, Electronic components, Energy dissipation, Engineers, Heat sinks, Network models
Proceedings Papers

Thermal Transport Network Model for High-Porosity Materials: Application to Nanoporous Aerogels

Brian R. Smith, Peter D. Beutler, Cristina H. Amon
Proc. ASME. HT2005, Heat Transfer: Volume 4, 955-961, July 17–22, 2005
Paper No: HT2005-72662
DOI: https://doi.org/10.1115/HT2005-72662
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Topics: Network models, Porosity, Thermal conductivity, Thermal properties, Heat, Manufacturing, Amorphous materials, Diffusion (Physics), Microelectromechanical systems, Microelectronic devices
Proceedings Papers

Heat Transfer Simulation Using PSpice

Shuhui Li, Rajab Challoo, Robert A. McLauchlan
Proc. ASME. HT2003, Heat Transfer: Volume 3, 589-595, July 21–23, 2003
Paper No: HT2003-47021
DOI: https://doi.org/10.1115/HT2003-47021
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Topics: Heat transfer, Simulation, Circuits, Flow (Dynamics), Network models