0
RESEARCH PAPERS

Thermal Analysis of Composite Phase Change Drywall Systems

[+] Author and Article Information
K. Darkwa1

The Applied Energy and Environmental Engineering Group (AE&EEG), School of the Built Environment,  Nottingham Trent University, Burton Street, Nottingham NG1 4BU, UKkojo.darkwa@ntu.ac.uk

J. S. Kim

The Applied Energy and Environmental Engineering Group (AE&EEG), School of the Built Environment,  Nottingham Trent University, Burton Street, Nottingham NG1 4BU, UK

1

Corresponding author. Fax: +44(0)115 848 6507.

J. Sol. Energy Eng 127(3), 352-356 (Jun 03, 2004) (5 pages) doi:10.1115/1.1877492 History: Received December 08, 2003; Revised June 03, 2004

The main barriers affecting the performance of phase change materials (PCM) wallboard system during energy recovery mode are identified as inadequate heat transfer and overall reduction in thermal conductivities. In order to assess the extent of these barriers, two integrated PCM drywall systems (i.e., randomly mixed and laminated PCM systems) have been evaluated numerically. The results showed a great advantage of the laminated PCM-wallboard system over the randomly mixed PCM type in terms of enhanced thermal performance and rapid heat transfer rates under narrow temperature swing. For instance, the maximum instantaneous enhancement in heat flux obtained was between 20% and 50% higher during the phase change process and up to about 18% more heat storage and release capacity. Experimental evaluation is, however, required towards validation and development of the laminated system.

FIGURES IN THIS ARTICLE
<>
Copyright © 2005 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 1

(a) Randomly distributed PCM drywall system. (b) Laminated PCM drywall system.

Grahic Jump Location
Figure 2

(a) Phase change transformation profile in PCMs. (b) An elemental PCM drywall.

Grahic Jump Location
Figure 3

Laminated PCM wallboard at different conditions

Grahic Jump Location
Figure 6

Percentage cumulative heat transfer enhancement of laminated system

Grahic Jump Location
Figure 5

Percentage heat flux enhancement of laminated wallboard system

Grahic Jump Location
Figure 4

Randomly distributed PCM wallboard at different conditions

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In