Thermal Contact Electronic Packaging in Solar Pointing Space Environment

[+] Author and Article Information
Kurt O. Lund, Anthony M. Colangelo, Gregory S. McKim

Department of Mechanical Engineering, San Diego State University, San Diego, CA 92182-0191

J. Sol. Energy Eng 113(1), 42-50 (Feb 01, 1991) (9 pages) doi:10.1115/1.2929950 History: Received October 16, 1989; Revised August 28, 1990; Online June 06, 2008


A thermal design for a solar pointing Space Shuttle mission is presented. The apparatus, which will measure solar flux intensity variations, contains sensors and data acquisition electronics which must be maintained within certain temperature constraints. The thermal design, which utilizes parallel heat flow paths and conduction fins to reject dissipated heat, is shown by finite difference thermal modeling to maintain component temperatures within these constraints. In the thermal modeling, arithmetic nodes are used to represent surface radiosity for radiation heat transfer. Also, the concept of mean fin conduction length and effective fin capacitance are introduced as means of simplifying the model representation of the conduction fins. An experiment was conducted to evaluate the chip/fin contact conductance.

Copyright © 1991 by The American Society of Mechanical Engineers
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